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High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module
High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module
High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module
High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module
Specifications
Brand Name :
ZIITEK
Model Number :
TIF140-60-06S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Supply Ability :
10000/day
Delivery Time :
3-5work days
Packaging Details :
1000pcs/bag
Payment Terms :
TT
Product name :
High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness1.0mm Thermal Pad For Graphics Card Thermal Module
Thermal conductivity :
6.0W/m-K
Density :
3.4 g/cm³
Color :
White
Hardness(Shore 00) :
45
Materials :
Ceramic filled silicone elastomer
Operating Temp :
-40~200℃
Keywords :
Thermal Pad
Application :
Graphics Card Thermal Module
Description

High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

The TIF®140-60-06S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:


> Good thermal conductive: 6.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

Typical Properties of TIF®100-60-06S Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.020~0.200 ASTM D374
0.50mm~5.0mm
Hardness 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-meter ASTM D257
Flame rating 94-V-0 UL E331100
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

Company profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Product tags

led aluminum heatsink

,

led heat sink aluminum

,

100w led passive heatsink
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High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

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Product Detail
Brand Name :
ZIITEK
Model Number :
TIF140-60-06S
Certification :
UL and RoHs
Place of Origin :
China
MOQ :
1000pcs
Price :
Negotiation
Contact Supplier
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High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module
High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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