Light amber 1.8W Phase Changing materials High Thermal of K10 Thermally pad for Car Battery & Power Supply
The TIC800K Series products is a high thermal conduction and dielectric performance insulator pad
 consisting of a ceramic filled low melting point compound coated on MT Kapton film.At 50℃,TIS™700K Series surface begins to soften and flow, filling the microscopic irregularities of both thethermal solution and the integrated circuit package surface, thereby reducing thermal resistan
TIC800K Series Datasheet-(E)-REV01.pdf
Feature
| Naturally tacky at room temperature, no adhesive required | 
| No heat sink preheating required | 
| Low thermal resistance | 
| Ease of use for high volume manufacturing | 
| High thixotropic index | 
| Dry to the touch for pre-apply applications | 
| High thermal reliability, minimal pump out | 
| Re-flow compatible | 
| Cost Effective | 
| Used where electrical isolation is not required | 
| Low volatility – less than 1% | 
| Easy to handle in the manufacturing environment | 
| Flows but doesn’t run like grease | 
| Available in custom die-cut shapes, kiss-cut on rolls | 
| RoHS Compliant | 
Application
| High Frequency Microprocessors | 
| Notebook | 
| Computer Serves | 
| Memory Modules | 
| Cache Chips | 
| IGBTs | 
| COB Led | 
| Desktop PCs | 
| CPU | 
| Microprocessors | 
| Chipsets | 
| Graphic Processing Chips | 
| Custom ASICs | 
| Servers | 
| Memory Modules | 
| Power semiconductors | 
| Power conversion modules | 
| LED Power Supply | 
| LED Controller | 
| LED Lights | 
| LED Ceilinglamp | 

  
| Typical Properties of TICTM800K Series | ||||
| Product Name | TICTM804K | TICTM805K | TICTM806K | Test Method | 
| Color | light amber | light amber | light amber | Visual | 
| Thickness | 0.004" (0.102mm)  |  			0.005" (0.127mm)  |  			0.006" (0.152mm)  |  			|
| Thickness Tolerance | ±0.0008'' (±0.019mm)  |  			±0.0008'' (±0.019mm)  |  			±0.0012'' (±0.030mm)  |  			|
| Density | 2 g/cc | Helium Pycnometer | ||
| Temperature range | -25℃~125℃ | |||
| Phase Change Softening Temperature | 50℃~60℃ | |||
| Thermal Conductivity | 5.0 W/mK | ASTM D5470 (modified) | ||
| Thermal Impedance @ 50 psi(345 KPa) | 0.014℃-in²/W | 0.020℃-in²/W | 0.038℃-in²/W | ASTM D5470 (modified) | 
| 0.09℃-cm²/W | 0.13℃-cm²/W | 0.25℃-cm²/W | ||
