Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W
The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

 Features:
| No heat sink preheating required | 
| Low thermal resistance | 
| Ease of use for high volume manufacturing | 
| High thixotropic index | 
| Dry to the touch for pre-apply applications | 
| High thermal reliability, minimal pump out | 
| Re-flow compatible | 
| Cost Effective | 
| Used where electrical isolation is not required | 
| Low volatility – less than 1% | 
| Easy to handle in the manufacturing environment | 
| Flows but doesn’t run like grease | 
| Available in custom die-cut shapes, kiss-cut on rolls | 
Applications:
 > High Frequency Microprocessors
 > Notebook and Desktop PCs
 > Computer Serves
 > Memory Modules
 > Cache Chips
 > IGBTs
> Telecommunication
| Typical Properties of TIC™800Y Series | |||||
| Product Name | TICTM803Y | TICTM805Y | TICTM808Y | TICTM810Y | Testing standards | 
| Color | Yellow | Yellow | Yellow | Yellow | Visual | 
|  			 Composite Thickness   			
  |  			0.003" (0.076mm)  |  			0.005" (0.126mm)  |  			0.008" (0.203mm)  |  			0.010" (0.254mm)  |  			|
| Thickness Tolerance | ±0.0006" (±0.016mm)  |  			±0.0008" (±0.019mm)  |  			±0.0008" (±0.019mm)  |  			±0.0012" (±0.030mm)  |  			|
| Density | 2.2g/cc | Helium Pycnometer | |||
| Work temperature | -25℃~125℃ | ||||
| phase transition temperature | 50℃~60℃ | ||||
| Thermal conductivity | 0.95 W/mK | ASTM D5470 (modified) | |||
| Thermal lmpedance @ 50 psi(345 KPa) | 0.021℃-in²/W | 0.024℃-in²/W | 0.053℃-in²/W | 0.080℃-in²/W | ASTM D5470 (modified) | 
| 0.14℃-cm²/W | 0.15℃-cm²/W | 0.34℃-cm²/W | 0.52℃-cm²/W | ||
