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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
Specifications
Brand Name :
Ziitek
Model Number :
TIC™803A
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Supply Ability :
100000pcs/day
Delivery Time :
3-5days
Packaging Details :
1000pcs/bay
Product Name :
Phase Changing Materials
Color :
Gray
Thermal Conductivity :
2.5 W/mK
phase transition temperature :
50℃~60℃
Density :
2.5g/cc
Work Temperature :
-25℃～125℃
Description

2.5 W / mK Phase Changing Materials For IGBTs Cache Chips High Thermal Conductive

The TIC™803A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.


The TIC™803A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Features:


> 0.018℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications:


> High Frequency Microprocessors

> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

Typical Properties of TIC™800A Series
Product Name
TICTM803A
TICTM805A
TICTM808A
TICTM810A
Testing standards
Color
Ashy
Ashy
Ashy
Ashy
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
　
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
　
Density
2.5g/cc
Helium Pycnometer
Work Temperature
-25℃～125℃
　
phase transition temperature
50℃~60℃
　
Setting temperature
70℃ for 5 minutes
　
Thermal conductivity
2.5 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
0.018℃-in²/W
0.020℃-in²/W
0.047℃-in²/W
0.072℃-in²/W
ASTM D5470 (modified)
0.11℃-cm²/W
0.13℃-cm²/W
0.30℃-cm²/W
0.46℃-cm²/W
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
Product tags

intermediate temperature sofc

,

pcb soldering temperature

,

smd soldering temperature
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2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required

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Product Detail
Brand Name :
Ziitek
Model Number :
TIC™803A
Certification :
RoHs
Place of Origin :
China
MOQ :
1000PCS
Price :
negotiation
Contact Supplier
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required
2.5 W / mK Phase Changing Materials For Cache Chips High Thermal Conductive No heat sink preheating required

Dongguan Ziitek Electronic Materials & Technology Ltd.

Verified Supplier
11 Years
guangdong, dongguan
Since 2006
Business Type :
Manufacturer
Main Products :
Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler
Total Annual :
100000-160000
Employee Number :
100~150
Certification Level :
Verified Supplier
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