Electronics Production Machinery
Aug 21, 2026
10 views
Product Description: Fully Automatic High Precision Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting Machine Features Front-loading and rear-loading methods, compatible with docking station ...learn more
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
50
$28,000-28,500
Contact Now

Shenzhen Hongxinteng Technology Co., Ltd.

Verified Supplier
2 Years
Replace a batch

Find Similar Products By Category:

Supplier Homepage Products Electronics Production Machinery
MachineU Video Channel Machinery Electronic Products Machinery
Contact Supplier
Submit Requirement