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Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Specifications
MOQ :
1
Price :
$28,000-28,500
Brand Name :
GKG
Certification :
ce
Place of Origin :
China
Payment Terms :
T/T
Supply Ability :
50
Delivery Time :
20day
Packaging Details :
Vacuum Wooden Box Packaging
Weight :
1200KG
Cycle Time :
150ms
Die Dimensions :
0.076mm*0.076mm-2mm*2mm
Name :
Flip Chip Die Bonder Machine
Application :
LED Chip Manufacturing
Type :
SMT Production Line
Description
Fully Automatic High Precision Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Machine Features
  • Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
  • Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
  • Direct-drive motor for bonding head operation
  • Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
  • Automatic angle correction system for wafer frame
  • Automatic wafer ring loading/unloading system for enhanced production efficiency
  • Precision automation ensures improved production efficiency and reduced operational costs
Technical Specifications
Production Cycle 150ms (depends on chip size and bracket)
XY Accuracy ±1mil (±0.025mm)
Die Rotation ±3°
Die XY Workbench
Die Dimensions 3mil*3mil-80mil*80mil (0.076mm*0.076mm-2mm*2mm)
Max. Angle Correction ±15°
Max. Die Ring Size 6″ (152mm) outer diameter
Max. Die Area 4.7″ (119mm) after expansion
Resolution Ratio 0.04mil (1μm)
Thimble Z Height Stroke 80mil (2mm)
Image Recognition System
Grey Scale 256 (Level Grey)
Resolution 720(H)*540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder 105° rotatable die bonding
Die Bond Pressure Adjustable 30g-250g
Loading Workbench
Range of Stroke 500mm*120mm
XY Resolution 0.02mil (0.5μm)
Suitable Holder's Size
Length 300mm-500mm
Width 80mm-120mm
Facilities Needed
Voltage/Frequency 220V AC±5%/50HZ
Compressed Air 0.5MPa (MIN)
Rated Power 1200W
Gas Consumption 40L/min
Volume and Weight
Dimensions (L*W*H) 1900*980*1620mm
Weight 1200KG
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Frequently Asked Questions
Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?
  1. Consult with us online or via email
  2. Negotiate and confirm final price, shipping, and payment terms
  3. Receive and confirm proforma invoice
  4. Make payment as specified
  5. We prepare your order after full payment confirmation
  6. 100% quality check before shipping
  7. Delivery by air or sea
Why choose our company?
  1. We are the actual manufacturers
  2. Over ten years of experience in the machine industry
  3. Commitment to high quality and timely delivery
  4. 24-hour after-sales support
Send your message to this supplier
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Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

Ask Latest Price
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Product Detail
MOQ :
1
Price :
$28,000-28,500
Brand Name :
GKG
Certification :
ce
Place of Origin :
China
Payment Terms :
T/T
Contact Supplier
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Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting
Fully Automatic High Precision Flip Chip Die Bonder Machine SMT Production Line for Semiconductor Packaging Chip Mounting

Shenzhen Hongxinteng Technology Co., Ltd.

Verified Supplier
2 Years
shenzhen
Since 2008
Business Type :
Manufacturer
Main Products :
Pick And Place Machine, Reflow Oven, SMT AOI Machine
Total Annual :
5000000-8000000
Employee Number :
100~150
Certification Level :
Verified Supplier
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