High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Video from China

Pick And Place Machine

Apr 29, 2026

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Product Description: Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Die Bonding Machine Strip Die Bonder-Dual Dispensing Machine Features ● Front-loading and rear-loading methods, ...learn more

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder

The production capacity is 50 units a month

28000

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Shenzhen Hongxinteng Technology Co., Ltd.

Verified Supplier

2 Years

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