MachineU > China Products > Machinery
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
Specifications
Brand Name :
HOSON
Model Number :
GTS80AH-I
Certification :
CE
Place of Origin :
China
MOQ :
1
Price :
28000
Payment Terms :
T/T
Supply Ability :
The production capacity is 50 units a month
Delivery Time :
25-30
Packaging Details :
Vacuum packing plus wooden box packing
Application :
COB Light source
Name :
Semiconductor die Bonder smt Machine
Maximum board size :
500mmx120mm
Condition :
Original new
Usage :
SMD LED SMT
core components :
PLC, Engine, Bearing, Gearbox, motor, Pressure vessel, Gear, Pump
Brand :
HOSON
Description

Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder Die Bonding Machine


Strip Die Bonder-Dual Dispensing

Machine Features
● Front-loading and rear-loading methods, compatible with a docking station, facilitate operator operation and connection, improving production cycle time;
● Utilizes internationally leading dual die bonding, dual dispensing, and dual wafer search systems;
● Utilizes a direct-drive motor to drive the bonding head;
● Utilizes a linear motor to drive the wafer search platform (X/Y) and feed platform (B/C);
● Utilizes an automatic angle correction system for the wafer frame;
● Equipped with an automatic wafer ring loading and unloading system, effectively improving production efficiency;
● Precision automation equipment effectively ensures that businesses improve production efficiency and reduce costs, thereby effectively enhancing their competitiveness.


Mainly used in flip-chip applications such as 0.5-meter flexible light strips

Cycle: 150ms

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder


Product specification

Production Cycle 150ms cycle depends on chip size and bracket
XY Accuracy ±1mil(±0.025mm)
Die Rotation ±3°
Die XY Workbench
Die Dimensions 3mil×3mil-80mil×80mil (0.076mm*0.076mm-2mm*2mm)
Max. Angle Correction ±15°
Max. Die Ring Size 6″ (152mm) outer diameter
Max. Die Area 4.7″ (119mm) after expansion
Resolution Ratio 0.04mil (1μm)
Thimble Z Height Stroke 80mil(2mm)
Image Recognition System
Grey Scale 256 (Level Grey)
Resolution 720(H)×540(V)(Pixels)
Die Bonder’s Swing Arm-and-hand system
Swing Arm of Die Bonder 105° rotatable die bonding
Die Bond Pressure Adjustable 30g-250g
Loading Workbench
Range of Stroke 500mmx120mm
XY Resolution 0.02mil(0.5μm)
Suitable Holder’s Size
Length 300mm-500mm
Width 80mm-120mm
Facilities Needed
Voltage/Frequency 220V AC±5%/50HZ
Compressed Air 0.5MPa(MIN)
Rated Power 1200W
Gas Consumption 40L/min
Volume and Weight
Length x Width x Height 1900×980×1620mm
Weight 1200KG


Applications:

For LED packaging, screen display field, consumer electronics, smart home, intelligent lighting and other fields of high-precision & high-speed solidification equipment.

Applicable products: LED 2835,5050,21211010,0603,020, semiconductor and COB LED products such as solid crystal.


High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder


Send your message to this supplier
Send Now

High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder

Ask Latest Price
Watch Video
Product Detail
Brand Name :
HOSON
Model Number :
GTS80AH-I
Certification :
CE
Place of Origin :
China
MOQ :
1
Price :
28000
Contact Supplier
video
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic Double Swing Die Bonder

Shenzhen Hongxinteng Technology Co., Ltd.

Verified Supplier
1 Years
shenzhen
Since 2008
Business Type :
Manufacturer
Main Products :
Pick And Place Machine, Reflow Oven, SMT AOI Machine
Total Annual :
5000000-8000000
Employee Number :
100~150
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products Pick And Place Machine
MachineU China Products Machinery
Contact Supplier
Submit Requirement