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Product description
1,All in one machine, in same XYZ motion table combine selective fluxing and soldering, compact & full function. 2,PCB board movement, fluxer nozzle and solder pot fixed. 3,High quality soldering. 4,Can used beside production line, flexible for production line forming. 5,Full PC control. All parameters can set in PC and saved to PCB menu, like moving path, solder temperature, flux type, solder type ,n2 temperature etc, best trace-ability and easy to get repeat soldering quality All software system developed by base on Windows7 system, with good trace-ability. Use scanned picture as background for path programming, moving speed, dwell time, empty move speed, Z height , wave height etc all programmed for different solder site. Critical parameters are totally under monitoring by PC software, like temperature, speed, pressure etc. Motion table was designed base on lighting concept. Servo motor and stepping motor provide motion power, ball screw synchronous belt and linear guide rail guide, accurate positioning, low noise, and smooth movement Japan original injection valve, adapt to various flux Flux is stocked by PP plastic pressure tank, make sure pressure stable without influenced of amount of flux. Tin furnace temperature, nitrogen temperature, wave height, etc. can be set by computer The tin furnace liner is made of titanium alloy stainless steel without leakage. External heating plate, uniform heat transfer N2 online heating system, to wet the soldering perfectly and reduce the solder dross. Load board manually and unload board manually Metal welding structure, with thick metal plate as base, so to reduce vibration and make machine more stable.

Key Features
- All-in-one machine combining selective fluxing and soldering in a compact XYZ motion table
- Fixed fluxer nozzle and solder pot with moving PCB board for precise operation
- Delivers high-quality soldering results for automotive electronics production
- Flexible placement beside production lines for efficient workflow integration
- Full PC control with parameter storage for consistent, repeatable soldering quality
- Windows 7-based software with excellent traceability and intuitive path programming
- Comprehensive monitoring of critical parameters including temperature, speed, and pressure
- Precision motion system with servo and stepping motors for accurate positioning
- Japanese injection valve accommodates various flux types
- Titanium alloy stainless steel tin furnace liner prevents leakage
- N2 online heating system reduces solder dross and improves wetting
- Sturdy metal welding structure minimizes vibration for stable operation
Technical Specifications
| General Specifications |
| Model |
WDS-100B |
| Dimensions |
550mm (L) × 650mm (W) × 650mm (H) |
| Power Supply |
Single phase 220V 50HZ |
| Net Weight |
450KG |
| Max Solder Area |
350 × 250mm / 300 × 300mm / 350 × 300mm / 400 × 300mm |
| PCB Thickness Range |
0.2mm - 6mm |
| Position Accuracy |
±0.1 mm |
| Flux Management |
| Flux Nozzle Type |
Jet valve |
| Flux Tank Capacity |
1 L |
| Solder Pot |
| Standard Pot Number |
1 |
| Solder Pot Capacity |
12 kgs/furnace |
| Max Solder Temperature |
350°C |
| N2 Management |
| N2 Temperature Range |
0-350°C |
| N2 Consumption |
1-2 m³/hour/tin mouth |
Application
Soldering Electronic componenets on PCB board.