An Inline SMT (Surface Mount Technology) Glue Dispensing Machine is an automated system commonly used in electronics manufacturing for dispensing adhesive (typically epoxy) precisely onto PCBs (Printed Circuit Boards) before component placement. This process ensures components are securely held in place during reflow soldering, especially on wave solder lines or when dealing with large or heavy components.
Thermal conductive adhesive, SMT bottom filling, component packaging, solder paste, red glue, black glue, semiconductor packaging, crystal cell fixation, etc
| Model | SMTID350 |
|---|---|
| Working Stroke | 400(X)x400(Y)x30(Z)mm |
| Moving Speed | 1000 mm/sec |
| Feeding Speed | 2-5m/min |
| Control Mode | Industrial computer + motion control card |
| Program Mode | Can import SMT machine files or online visual programming |
| Spindle drive | Servo motor + ball screw |
| Air Pressure | ≥0.65MPa |
| Nozzle cleaning device | Vacuum cleaning (optional) |
| Alarm System | Menu+sound and light alarm |
| Conveyor track | High temperature belt & 1-stage shutdown mode |
| Valve quantity | 1 |
| Valve Type | Piezoelectric injection valve |
| Repetitive accuracy | ±0.01mm |
| Material capacity | 30CC |
| Material detection | Automatic |
| communication interface | SMEMA |
| Transmission Direction | L-->R or R-->L |
| Power | 220V, 50/60Hz, 2.5KW |
| Dimension (W*D*H) | 790(L)x1600(W)x1600(H)mm |
| Weight | 700kgs |

TYPICAL FLUID APPLICATION FOR SMARTPHONES
