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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors
Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors
Specifications
Brand Name :
Hanast
Model Number :
HN-5508AB
Certification :
ROHS SGS
Place of Origin :
Guangdong,China
MOQ :
1kg
Payment Terms :
T/T
Packaging Details :
25kgs/barrel
Price :
Negotiable
Feature :
flame retardant insulation, sealing bonding, moisture-proof
Waterproof :
Yes
Consist :
Epoxy resin A, Curing agent B
Hardness shore A :
85-95
Viscosity :
Low Viscosity
Appearance :
A sticky epoxy resin water,liquid
mixing ratio :
A: B =5:1 (weight ratio)
Water absorption rate was 25℃ * 24H :
<0.03%
low temperature resistant ℃ :
-30
Shelf time :
6 months (25℃)
Description

85 Hardness Silicone For Encapsulation Connectors 5:1 Epoxy Potting Glue Black Color For Transformer Resistors 2 Components Potting Compound Material

Product descriptions:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product

Product features:

Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

Before curing

builder

Epoxy resin 5508

Curing agent 5508

pigment

Black / White et al

Ruburn / transparent surface

A sticky epoxy resin water

r liquid specific

c gravity, g / cm3

1.4-1.5

1.05

Viscosity of 25℃

4,500—6,000cp s

150—250cp storage

e Period (25℃)

Six months

x months

processabili

mixing ratio

A: B =5:1 (weight ratio)

Available for a time of 25℃

2-3H (100g mix)

curing time

25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

After curing

2 Tensile strength of kg/cm

16-18

2 Compressive strength of kg/cm

18-22

Resistance to the voltage of kv/mm

20-22

Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%

0.35-0.55

Water absorption rate was 25℃ * 24H

<0.03%

The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

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Product Detail
Brand Name :
Hanast
Model Number :
HN-5508AB
Certification :
ROHS SGS
Place of Origin :
Guangdong,China
MOQ :
1kg
Payment Terms :
T/T
Contact Supplier
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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Shenzhen Haneste New Material co.,LTD

Verified Supplier
1 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Main Products :
Tin Cure Silicone Rubber, Platinum Cure Silicone Rubber, Clear Liquid Silicone
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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