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25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
Specifications
Brand Name :
Hanast
Model Number :
HN-5508AB
Certification :
MSDS
Place of Origin :
CHINA
MOQ :
1KG
Price :
6.2
Payment Terms :
T/T
Supply Ability :
1000000KG
Delivery Time :
3-5 work days
Packaging Details :
Plastic/Iron Drums
Product name :
Epoxy Resin potting glue
Color :
Black/Grey/Transparent color, can customized
Application :
PCB/Battery/LED
Package :
5kgs/25kgs/200kgs/bag
Material :
Epoxy Resin&Agent
Keywords :
Waterproof Sealant
Viscosity :
Excellent Viscosity
Certificate :
MSDS RoHS UL
Feature :
Low and high Temperature Resistance
Thermal conductivity :
Customize
Description

HN-5508 Epoxy Resin Potting Glue

Product Specification

Before curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
Surface A sticky epoxy resin water r liquid specific
specific gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
storage Period (25℃) Six months x months
processabilility mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing Tensile strength of kg/cm 16-18
Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm 14
1.2*10
Volume resistance ofΩ-cm 15
1.1*10
contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%
The hardness of SHORE A 85-95
Distortion temperature ℃ 130-150
low temperature resistant ℃ -30

Product Overview
HN-5508 is a two-component epoxy potting compound designed for room-temperature or low-temperature curing. With low viscosity, extended work time, and excellent fluidity, it penetrates easily into product gaps. After curing, it forms a bubble-free, smooth, and glossy surface with high hardness. The cured material exhibits outstanding resistance to acids, alkalis, moisture, and aging, along with superior electrical insulation, voltage resistance, and bonding strength. Ideal for electronic components requiring encapsulation, insulation, and environmental protection.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Product Features
Low viscosity: easy to penetrate into the gap of the product to ensure complete potting.

High hardness: the surface is smooth after curing, with high hardness, providing excellent mechanical protection.

Chemical resistance: acid and alkali resistance, moisture resistance, aging resistance, suitable for harsh environments.

Excellent electrical properties: high insulation, pressure resistance and bonding strength.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Application areas
Electronic appliances: transformers, resistors, filters, temperature sensors, etc.

Industrial equipment: high voltage packaging, aquarium equipment, ultrasonic atomizers, etc.

Others: components that require insulation, flame retardancy and temperature resistance.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Usage
Mix in a weight ratio of A:B = 5:1.

Operation time at 25℃ is 2-3 hours, surface curing in 6-8 hours, and full curing in 12-16 hours; or curing in 1.5-2 hours at 60-80℃.

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Packing specifications
30 KG/group (A component 25 KG/barrel, B component 5 KG/can)

25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
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25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

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Product Detail
Brand Name :
Hanast
Model Number :
HN-5508AB
Certification :
MSDS
Place of Origin :
CHINA
MOQ :
1KG
Price :
6.2
Contact Supplier
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25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components
25kg Thermally Conductive Potting Epoxy Resin Glue Compound For Electronic Components

Shenzhen Haneste New Material co.,LTD

Verified Supplier
1 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer
Main Products :
Tin Cure Silicone Rubber, Platinum Cure Silicone Rubber, Clear Liquid Silicone
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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