Two-Part Potting Compound | HN-8820 | Thermal Conductivity 2.0 W/m·K | Easy Cure

Product Overview for Thermally Conductive Potting Compound:
HN-8820 two-part silicone potting compound delivers 2.0 W/m·K thermal conductivity and robust environmental protection. Its 1:1 ratio and room-temperature cure simplify manufacturing.
Performance Highlights for Thermally Conductive Potting Compound
Easy 1:1 mix by weight or volume
Non-corrosive and safe to use
Stable over a wide temperature range
Good chemical resistance

Technical Parameters for Thermally Conductive Potting Compound:
• Base: Polysiloxane
•Viscosity: 5000–8000 cP
•Resistivity: ≥5.0×10¹⁴ Ω·cm
•Flame Rating: V-0
Applications for Thermally Conductive Potting Compound:
Motor drives
Battery management systems
RF modules
Consumer electronics

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.
Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.
Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

FAQ for Thermally Conductive Potting Compound:
Q: What is the thermal conductivity?
A: 2.0 W/m·K.
Q: Is it suitable for potting coils?
A: Yes, it penetrates well.
Q: Can it be applied manually?
A: Yes, for small batches.
Q: Does it support rework?
A: It can be removed mechanically.
Q: Is it waterproof?
A: Yes, fully.