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Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Specifications
Brand Name :
Hanast
Model Number :
HN-8820A/B
Certification :
FDA/ROHS/REACH
Place of Origin :
Guangdong, China
MOQ :
1KG
Price :
Negotiable
Payment Terms :
T/T、paypal
Supply Ability :
50ton/month
Delivery Time :
7-10days
Packaging Details :
50KG/set, 25KG/bar
Mix Ratio :
5000–8000 cP
Pot Life (25°C) :
40-60 minutes
Cure Time (25°C) :
4-6 hours (tack-free), 24 hours (full cure)
Hardness :
45–50 Shore A
Density :
2.36 g/cm³
Cure @ 80°C :
10–20 min
Volume Resistivity :
≥5.0×10¹⁴ Ω·cm
Flame Retardancy :
V-0
Description

HN-8820 Potting Gel | 1:1 Mix Ratio | High Thermal Conductivity | UL94 V-0


Product Overview for Thermally Conductive Potting Compound:

HN-8820 is a thermally conductive silicone encapsulant that safeguards sensitive electronics against overheating and environmental damage. It is simple to use and highly reliable.

Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

Performance Highlights for Thermally Conductive Potting Compound

Thermal conductivity: 2.0 W/m·K

V-0 self-extinguishing

Good adhesion to most substrates

Resists thermal cycling

Technical Parameters for Thermally Conductive Potting Compound:

• Mix Ratio: 1:1
• Pot Life: 60–120 min
• Cure Time: 2–4 hrs @ 25°C
• Density: 2.36 g/cm³

Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

Applications for Thermally Conductive Potting Compound:

Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

  • Motor drives

  • Battery management systems

  • RF modules

  • Consumer electronics

Handling Guide for Thermally Conductive Potting Compound:
Mix A and B 1:1 by weight, degas under vacuum, pour into clean housing, and cure at room temperature or 80°C for faster results.

Important Notes for Thermally Conductive Potting Compound:
Avoid contact with sulfur, tin, amines, or acidic substances.

Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

Packaging & Storage for Thermally Conductive Potting Compound:
50 kg set (A 25 kg + B 25 kg). Store in a cool, dry place. Shelf life: 6 months.

Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

FAQ for Thermally Conductive Potting Compound:

Q: Is HN-8820 flexible?
A: Yes, it remains elastic.

Q: Can I heat cure it?
A: Yes, at 80°C for 10–20 min.

Q: Does it contain solvents?
A: No, it’s solvent-free.

Q: Is it reusable after opening?
A: Reseal tightly; use within shelf life.

Q: Can it be used for high-power devices?
A: Yes, thanks to its high thermal conductivity.

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Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

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Product Detail
Brand Name :
Hanast
Model Number :
HN-8820A/B
Certification :
FDA/ROHS/REACH
Place of Origin :
Guangdong, China
MOQ :
1KG
Price :
Negotiable
Contact Supplier
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Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules
Silicone Encapsulant HN-8820 | 2.0 W/m·K | For Electronics & Automotive Modules

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer, Agent, Trading Company
Main Products :
Silicone Potting Compound, Epoxy Potting Compound, Platinum Cure Silicone Rubber
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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