Specifications
Brand Name :
Hanast
Model Number :
HN-5508A/B
Certification :
ROHS,SGS
Place of Origin :
Guangdong, China
MOQ :
1 kilogram
Price :
Negotiable
Payment Terms :
T/T
Delivery Time :
5-7days
Packaging Details :
25KG/ Iron Drum
Name :
Epoxy Potting Compound
Mix ratio :
5:1
Hardness :
80-95 shore D
Color :
Black,clear
distortion temperature ℃ :
130-150
Feature :
flame retardant insulation, sealing bonding
Customization :
Support
Application :
transformers, resistors, filters, temperature sensors
2 Compressive strength of kg/cm :
18-22
Description

Epoxy Potting Compound 5:1 Electrical Adhesive Potting For Power Module Transformer PCB SENSOR



Product Description of epoxy potting compound:
Epoxy potting compound is a high-performance insulating and sealing material, mainly used to protect electronic components through potting, filling, or encapsulation, and cured at room temperature or by heating.

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Product Features of epoxy potting compound:

Insulation and Sealing: Moisture-proof, corrosion-proof, and dust-proof, suitable for harsh environments.

Mechanical Protection: High hardness after curing, resistant to vibration and impact.

Thermal Management: Some models have good thermal conductivity, aiding in component heat dissipation.

Chemical Stability: Resistant to acids, alkalis, and solvents, extending product lifespan.

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Physical Properties of epoxy potting compound:

efore curing builder Epoxy resin 5508 Curing agent 5508
pigment Black / White et al Ruburn / transparent surface
A sticky epoxy resin water r liquid specific
c gravity, g / cm3 1.4-1.5 1.05
Viscosity of 25℃ 4,500—6,000cp s 150—250cp storage
e Period (25℃) Six months x months

processabili

mixing ratio A: B =5:1 (weight ratio)
Available for a time of 25℃ 2-3H (100g mix)
curing time 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing 2 Tensile strength of kg/cm 16-18
2 Compressive strength of kg/cm 18-22
Resistance to the voltage of kv/mm 20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage% 0.35-0.55
Water absorption rate was 25℃ * 24H <0.03%

The hardness of SHORE A 85-95

distortion

temperature ℃

130-150
low temperature resistant ℃ -30


Product application of epoxy potting compound

Power Modules:Switching power supplies, inverters, UPS systems, transformers, etc., used for moisture-proofing, heat dissipation, insulation, and shock resistance.

Circuit Board Protection:Waterproof and dustproof sealing for PCBs, sensors, and controllers (e.g., automotive ECUs, industrial PLCs).

High-Voltage Equipment:High-voltage capacitors, ignition coils, insulators, etc., to enhance insulation and arc resistance.

New Energy Equipment:Protection for internal components of solar inverters, wind power controllers, and charging piles.

Automotive Electronics: Engine control modules (ECUs), onboard chargers, battery management systems (BMS), headlight drivers, etc.

Rail Transportation: Insulation and sealing for signaling control systems and traction converters.

Aerospace:Protection for airborne electronic equipment against high/low temperatures and vibration.

Motors and Drives:Potting for windings of servo motors and stepper motors to improve thermal conductivity and environmental resistance.

Industrial Sensors: Protection for pressure/temperature/flow sensors in harsh environments (e.g., chemical plants, oil fields).

Tool Equipment: Sealing for circuit modules in power tools and welding equipment.

Lithium Battery Packs: Filling gaps between cells and securing modules to enhance heat dissipation and mechanical stability.

Photovoltaic Systems:Waterproof sealing for PV junction boxes and combiner boxes.

Hydrogen Energy Equipment:** Sealing and insulation for fuel cell stacks.

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Package:

This product is 40KG per group;

Component A is 20KG (in barrels), and Component B is 20KG (in barrels)

About our company
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

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Epoxy Potting Compound 5:1 Electrical Adhesive Potting For Power Module Transformer PCB SENSOR

Ask Latest Price
Brand Name :
Hanast
Model Number :
HN-5508A/B
Certification :
ROHS,SGS
Place of Origin :
Guangdong, China
MOQ :
1 kilogram
Price :
Negotiable
Contact Supplier
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR
Epoxy Potting Compound 5:1 Electrical  Adhesive Potting For Power Module Transformer PCB SENSOR

Shenzhen Hanast New Material co.,LTD

Verified Supplier
2 Years
guangdong, shenzhen
Since 2010
Business Type :
Manufacturer, Agent, Trading Company
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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