This SAS4/PCIe 68-Pin SMT Female Connector is designed for next-generation high-speed data transmission systems, supporting SAS 4.0 and PCIe bandwidth requirements.
It features 30µ" gold-plated contact terminals, nickel underplating, and 100µ" matte-tin solder areas, ensuring exceptional conductivity, corrosion resistance, and long-term durability.

The connector uses UL94-V0 LCP housing and high-strength C5191 phosphor bronze terminals, providing superior mechanical stability and reliability under high-frequency, high-signal-integrity environments.
Thanks to its SMT surface-mount design, it is optimized for automated PCB assembly and compact high-density layouts.

With a wide operating temperature range, strong mechanical endurance, and compliance with RoHS 2.0 & Halogen-Free standards, this connector is ideal for server-level storage devices, automotive electronics, and industrial systems requiring stable high-speed signal transmission.

Key Features

• Supports SAS 4.0 / PCIe High-Speed Transmission
• 30U" Gold-Plated Contacts for improved conductivity and signal integrity
• 100U" Matte Tin Solder Area ensures secure and stable SMT soldering
• UL94-V0 LCP Housing with high heat resistance for reflow soldering
• High Mechanical Reliability with up to 500 mating cycles
• Excellent Resistance to Corrosion and Oxidation
• SMT Design suitable for automated production lines
• Environmental Compliance: HF + RoHS 2.0
• Ideal for High-Frequency / High-Speed PCB Design

⚙️ Applications

1. Server & Storage Equipment

SAS HDD/SSD

RAID expansion cards

Storage backplanes

Data center servers

2. Communication & Networking Devices

Routers and switches

Edge computing devices

Telecom base stations

3. Industrial & Automation Systems

PLC controllers

Industrial IPC motherboards

Motion control modules

4. Automotive Electronics

ADAS data logging

Vehicle storage modules

Smart cockpit controllers

5. High-Density PCB Designs

Compact electronic systems

Multi-board interconnection modules

⚠️ Notes

• Follow reflow soldering temperature suitable for LCP UL94-V0 material.
• Ensure all gold contact areas remain clean and free from oxidation or oil.
• Maintain ESD protection during handling and assembly.
• PCB layout should strictly follow recommended footprint to avoid misalignment.
• Avoid excessive mechanical force that could deform terminals.
• Keep products in moisture-proof packaging with desiccant until use.
• Avoid mating with severely oxidized male connectors to prevent signal loss.
• Store in a dry, temperature-controlled environment to maintain plating performance.