The SAS 29P SMT Female Connector is designed for high-speed, reliable signal transmission. Featuring 15µ" gold-plated contacts and 100µ" tin-plated solder areas, this connector ensures excellent electrical conductivity and stable, long-term performance in demanding applications.

Constructed with LCP UL94-V0 housing and C5191-H phosphor bronze terminals, it provides durability and thermal resistance, ensuring reliable mechanical and electrical performance. The 1.27mm pin pitch and SMT configuration make it ideal for high-density PCB designs.

This connector is particularly suitable for automotive electronics, industrial control systems, telecommunication equipment, and high-speed data transmission applications. The RoHS 2.0 compliance ensures it meets global environmental standards.

Key Features

• Gold-Plated Contacts (15µ") for superior electrical conductivity and long-lasting performance
• Matt Tin Solder Areas (≥80µ") for durable and secure PCB mounting
• LCP UL94-V0 Housing provides high thermal stability during reflow soldering
• Low Contact Resistance (≤ 30mΩ) for stable signal transmission
• Strong Mechanical Retention with ≥1.0 Kgf per pin
• Durable Performance with 500 mating cycles
• RoHS 2.0 + Halogen-Free Compliant for environmental sustainability
• Ideal for High-Density PCB Designs with a compact 4.20mm pitch

⚙️ Applications

1. Server & Storage Devices

SAS HDD/SSD modules

RAID controller boards

Server backplanes

High-speed data transmission lines

2. Communication Equipment

Network routers and switches

Optical-electrical conversion modules

Edge computing devices

3. Automotive Electronics

ADAS data modules

In-vehicle storage interfaces

ECU signal connectors

4. Industrial Control Systems

PLC controllers

Industrial computers

Data acquisition boards

5. PCB & High-Speed Signal Designs

Multi-board connectivity

Fine-pitch high-density boards

High-speed signal routing applications

⚠️ Notes

• Ensure proper PCB layout to match the 4.20mm pin pitch to avoid misalignment during assembly.
• Use proper soldering temperatures to prevent LCP housing deformation during reflow soldering.
• Keep the gold-plated contact area clean and free from contamination or oxidation.
• Verify contact resistance and insulation resistance meet application specifications.
• Avoid excessive mechanical force during mating and unmating to preserve terminal integrity.
• Store connectors in dry, anti-static packaging until use to avoid damage.
• Maintain ESD protection throughout the assembly process to avoid electrostatic discharge damage.