This SAS 29-Pin SMT Female Connector features a compact, high-density design optimized for SAS high-speed signal transmission.
It uses Gold Flash (G/F) plating on the contact area with ≥50u" nickel underplating, ensuring stable conductivity, corrosion resistance, and long-term durability for data-intensive applications.

The connector is built with UL94-V0 flame-retardant LCP housing and C2680-EH brass terminals, offering superior mechanical strength and excellent performance during SMT reflow soldering.
With low contact resistance (≤30mΩ), high insulation resistance, and up to 500 mating cycles, it is ideal for servers, storage devices, industrial equipment, and automotive electronics.

Key Features

• Gold Flash (G/F) plated contacts for cost-effective, reliable high-speed signal transmission
• UL94-V0 high-temperature LCP housing, suitable for SMT reflow
• ≥80u" matte tin solder area for robust PCB solder joints
• Precision SMT footprint for high-density PCB layouts
• Low electrical resistance ensuring strong signal and power transmission
• High mechanical retention including 0.70 kgf terminal retention and 1.0 kgf fork retention
• Full compliance with HF + RoHS 2.0 environmental standards
• Ideal for automated SMT assembly lines
• Supports customization (pin pitch, plating thickness, terminal design)

⚙️ Applications

1. Server & Storage Devices

SAS HDD/SSD modules

RAID controller boards

Server backplanes

High-speed data transmission lines

2. Communication Equipment

Network routers and switches

Optical-electrical conversion modules

Edge computing devices

3. Automotive Electronics

ADAS data modules

In-vehicle storage interfaces

ECU signal connectors

4. Industrial Control Systems

PLC controllers

Industrial computers

Data acquisition boards

5. PCB & High-Speed Signal Designs

Multi-board connectivity

Fine-pitch high-density boards

High-speed signal routing applications

⚠️ Notes

• Ensure SMT reflow temperature profile is suitable for LCP UL94-V0 material.
• Keep the gold-flash contact area clean and free from contamination or oxidation.
• Follow the recommended PCB pad layout to ensure optimal soldering performance.
• Protect terminals from bending during SMT handling.
• Properly control solder joint flatness before and after reflow to meet tolerance.
• Maintain ESD protection during assembly to avoid damage.
• Do not mate with oxidized or damaged male connectors to maintain signal integrity.
• Store in dry, anti-static packaging.