Specifications
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
20L
Material :
FR4
Board Thickness :
2.0mm
Min. Component Size :
01005
Min. Line Width/Spacing :
0.1mm
Pin Space :
0.2mm
Assembly Method :
SMT/DIP
Application :
Millimeter Wave Antenna Module
Description

Telecom PCB Assembly Millimeter Wave Antenna Module High Frequency Signal Processing

What's Telecom PCB Assembly?

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

  • ​​5G/4G base stations​​
  • ​​Fiber-optic networking devices​​
  • ​​Satellite communication systems​​
  • ​​Routers, switches, and modems​​
  • ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

Features of Telecom PCBs:

1. High-Frequency Materials​​

    • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
    • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

    • ​​8+ layers​​ for complex routing.
    • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

    • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
    • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

    • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

      • ​​IPC-A-600, IPC-6012​​ (for reliability).
      • ​​RoHS, REACH​​ (for environmental safety).
      • ​​FCC, CE, ITU-T​​ (for telecom regulations).

Precautions for Use and Maintenance

    • Environmental adaptation: Weather-resistant PCB for outdoor use (such as FR-4+UV coating, IP65 protection); Enhanced heat dissipation in high temperature environment.

    • Static protection: Wear an anti-static wristband and use an anti-static tray during operation (chip sensitivity <50V).

    • Regular inspection: TDR to measure signals, X-Ray to check BGA solder joints; clean the surface to prevent dust accumulation.

    • Avoid overload: prohibit over-current/voltage/rate to prevent module burning or packet loss.

    • Upgrade and maintenance: Official firmware upgrade, backup configuration parameters.

Technical Parameters

PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm

One-Stop PCBA Solution

20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm 20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm 20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm 20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm
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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production
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20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm

Ask Latest Price
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
20L
Material :
FR4
Board Thickness :
2.0mm
Contact Supplier
20 Layer SMT DIP Telecom PCB Assembly Circuit Board Electrical 2.0mm

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Employee Number :
>800
Certification Level :
Verified Supplier
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