High Frequency Low Loss Components Telecom PCB Assembly SMT Mounting Services
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
Components: Select high-frequency low-loss materials (such as PTFE substrates), high-temperature resistant chips (-40℃~125℃), and RF components require 50Ω impedance matching.
Manufacturing accuracy: patch accuracy ±0.025mm (normal ±0.05mm), support 01005 tiny components; laser drilling + micro-hole electroplating to achieve high-density wiring.
Special processes:
Impedance control: line/medium optimization, differential line impedance deviation within ±10%.
Electromagnetic shielding: metal cover/conductive glue isolates radio frequency interference.
Thermal management: heat sink/aluminum substrate conducts heat quickly to prevent chip overheating.
♦ Technical Parameters
|  			 PCB Assembly Capability  |  		|||||
|  			 
 Item  |  			 			 
 Normal  |  			 			 
 Special  |  		|||
|  			 
 
 
 
 
 
 
 
 SMT Assembly  |  			 			 
 
 PCB(used for SMT) specification  |  			 			 Length and Width( L* W)  |  			 			 Minimum  |  			 			 L≥3mm, W≥3mm  |  			 			 L<2mm  |  		
|  			 Maximum  |  			 			 L≤800mm, W≤460mm  |  			 			 L > 1200mm, W>500mm  |  		|||
|  			 Thickness( T)  |  			 			 Thinnest  |  			 			 0.2mm  |  			 			 T<0.1mm  |  		||
|  			 Thickest  |  			 			 4 mm  |  			 			 T>4.5mm  |  		|||
|  			 
 SMT components specification  |  			 			 Outline Dimension  |  			 			 Min size  |  			 			 0201(0.6mm*0.3mm)  |  			 			 01005(0.3mm*0.2mm)  |  		|
|  			 Max size  |  			 			 200 * 125  |  			 			 200 * 125  |  		|||
|  			 component thickness  |  			 			 T≤15mm  |  			 			 6.5mm<T≤15mm  |  		|||
|  			 QFP,SOP,SOJ (multi pins)  |  			 			 Min pin space  |  			 			 0.4mm  |  			 			 0.3mm≤Pitch<0.4mm  |  		||
|  			 CSP/ BGA  |  			 			 Min ball space  |  			 			 0.5mm  |  			 			 0.3mm≤Pitch<0.5mm  |  		||
|  			 
 
 DIP Assembly  |  			 			 
 PCB specification  |  			 			 
 Length and Width( L* W)  |  			 			 Minimum  |  			 			 L≥50mm, W≥30mm  |  			 			 L<50mm  |  		
|  			 Maximum  |  			 			 L≤1200mm, W≤450mm  |  			 			 L≥1200mm, W≥500mm  |  		|||
|  			 Thickness( T)  |  			 			 Thinnest  |  			 			 0.8mm  |  			 			 T<0.8mm  |  		||
|  			 Thickest  |  			 			 3.5mm  |  			 			 T>2mm  |  		|||
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