Specifications
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
4L
Material :
FR-4
Min. Component Size :
0201
Copper Thickness :
1OZ
Board Thickness :
1.6 mm
Surface Finish :
ENIG
Pin Space :
0.2mm
Application :
Communication
Description

Customizable Telecom PCB Assembly The Perfect Match for High-Speed Communication Equipment

What's Telecom PCB Assembly?

​​Telecom PCB Assembly​​ refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:

  • ​​5G/4G base stations​​
  • ​​Fiber-optic networking devices​​
  • ​​Satellite communication systems​​
  • ​​Routers, switches, and modems​​
  • ​​RF (Radio Frequency) and microwave systems​​

These PCBs require ​​high-frequency performance, signal integrity, and reliability​​ to handle fast data transmission, low latency, and harsh operational environments.

Features of Telecom PCBs:

1. High-Frequency Materials​​

    • Use ​​low-loss laminates​​ (e.g., Rogers, Teflon, or Isola) to minimize signal degradation at GHz frequencies.
    • ​​Controlled impedance​​ traces to prevent signal reflection.

2. Multilayer & HDI (High-Density Interconnect) Designs​​

    • ​​8+ layers​​ for complex routing.
    • ​​Microvias & blind/buried vias​​ for compact, high-speed designs.

3. RF & Microwave Components​​

    • ​​Antennas, amplifiers, filters​​, and ​​MMICs (Monolithic Microwave ICs)​​.
    • ​​Shielding​​ to reduce electromagnetic interference (EMI).

4. Thermal Management​​

    • ​​Metal-core PCBs (e.g., aluminum)​​, heat sinks, or thermal vias to dissipate heat from high-power components.

​​5. Strict Compliance Standards​​

      • ​​IPC-A-600, IPC-6012​​ (for reliability).
      • ​​RoHS, REACH​​ (for environmental safety).
      • ​​FCC, CE, ITU-T​​ (for telecom regulations).

Applications of Telecom PCBs:

  • 5G Infrastructure​​ (Massive MIMO, mmWave antennas)
  • ​​Optical Transceivers​​ (100G/400G data rates)
  • ​​Satellite Communication​​ (Low Earth Orbit (LEO) systems)
  • ​​IoT & Smart Devices​​ (NB-IoT, LTE-M modules)

Technical Parameters

PCB Assembly Capability

Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L<2mm

Maximum

L≤800mm, W≤460mm

L > 1200mm, W>500mm

Thickness( T)

Thinnest

0.2mm

T<0.1mm

Thickest

4 mm

T>4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm<T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch<0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch<0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L<50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T<0.8mm

Thickest

3.5mm

T>2mm

One-Stop PCBA Solution

Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm
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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm

Ask Latest Price
MOQ :
1
Price :
Contact us
Payment Terms :
T/T
Layer :
4L
Material :
FR-4
Min. Component Size :
0201
Contact Supplier
Customizable ENIG SMT Telecom PCB Assembly Circuit Board 1OZ 1.6mm

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Employee Number :
>800
Certification Level :
Verified Supplier
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