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Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device
Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device
Specifications
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
4 Layer
Board Thickness :
0.8m
Board Material :
Polyimide (PI)
Finished Copper :
0.5 OZ
Min Line Width/Spacing :
0.1/0.1mm
Surface Finish :
ENIG
Application :
Portable Devices
Certificate :
UL,IATF16949,ISO&Reach
Description

4 Layer PCB Flexible Board for Medical Device

♦ What is 4 Layer PCB?

A ​​4-layer PCB​​ is a printed circuit board with ​​four conductive copper layers​​ stacked together with insulating (dielectric) material in between. These layers are interconnected through ​​vias​​ (plated holes) to create complex circuits while saving space and improving performance compared to single or double-sided boards.

Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

♦ Structure of a 4-Layer PCB​

A typical 4-layer stackup consists of:

    1. ​​Top Layer (Signal Layer)​​ – Contains component placements and high-speed signal traces.
    2. ​​Inner Layer 1 (Ground Plane)​​ – Acts as a reference plane for EMI shielding and noise reduction.
    3. ​​Inner Layer 2 (Power Plane)​​ – Distributes stable power supply to components.
    4. ​​Bottom Layer (Signal Layer)​​ – Additional routing space for signals and components.

♦ ​​4-Layer PCB vs. 2-Layer PCB​​

Feature 4-Layer PCB 2-Layer PCB
​​Layers​​ 4 (Signal+GND+PWR) 2 (Top+Bottom)
​​Routing Space​​ ✅ High ❌ Limited
​​Signal Noise​​ ✅ Low (GND plane) ❌ Higher
​​EMI Shielding​​ ✅ Better ❌ Poor
​​Cost​​ ⚠️ Higher (~2x) ✅ Lower

♦ ​​Manufacturing Process​​

    1. ​​Design​​ – Use CAD tools (Altium, KiCad) to define layer stackup and routing.
    2. ​​Material Selection​​ – Choose core/prepreg materials (FR-4, Rogers).
    3. ​​Lamination​​ – Bond layers under heat/pressure.
    4. ​​Drilling & Plating​​ – Create vias for inter-layer connections.
    5. ​​Etching​​ – Remove excess copper to form traces.
    6. ​​Testing​​ – Verify continuity, impedance, and shorts.

♦ Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

♦ One-Stop PCBs Solution

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♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

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Product Detail
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
4 Layer
Board Thickness :
0.8m
Board Material :
Polyimide (PI)
Contact Supplier
Polyimide ENIG Rigid Flex PCB Fabrication 4 Layer Circuit Board For Medical Device

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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