Overview

Zero-defect quality is the standard for critical BGA applications—medical devices, automotive safety systems, aerospace electronics. Studio Electronics offers Zero-Defect BGA Assembly with X-Ray certified quality—ensuring every BGA on every board meets the most stringent quality requirements. As a premier provider of PCB assembly in China, we combine specialized BGA process expertise, 12 automated SMT lines, advanced 3D X-Ray inspection, and rigorous process control to deliver assemblies with documented, verifiable quality. Our complete turnkey service covers component procurement through final shipping.

Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Incoming inspection verifies component integrity and BGA ball condition.

Stage 2: Solder Paste Printing
Precision stencil with optimized aperture geometry. 3D SPI ensures consistent paste deposition; real-time feedback corrects printing variations.

Stage 3: Precision BGA Placement
12 SMT lines with ±25μm accuracy. Vision alignment ensures accurate ball-to-pad registration. Placement parameters optimized per BGA type.

Stage 4: Controlled Reflow
Custom reflow profiles per BGA type. Nitrogen reflow minimizes voiding. Closed-loop temperature control; real-time monitoring.

Stage 5: 100% X-Ray Certification

• 2D X-Ray – Ball alignment, bridging, missing balls

• 3D X-Ray – Void analysis; automated void calculation

• Void Target – <10% for critical applications; <15% for standard

• Certification – X-Ray verified; documented per board serial number

Stage 6: Testing & Final Assembly
ICT; Flying Probe; FCT; AOI for visible components. Reliability lab testing available. Careful handling; anti-static packaging; global logistics.

Studio delivers Zero-Defect BGA Assembly—X-Ray certified quality with complete documentation per board serial number.