MachineU > China Products > Machinery > Production line > Assembly line
High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs
High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs
Specifications
MOQ :
No MOQ
Place of Origin :
China
Supply Ability :
100,000 pieces/month
Packaging Details :
ESD Protective Packaging/Customization
Delivery Time :
5-25 working days(varies by product)
Price :
Quote based on your specs
Payment Terms :
T/T
Description
High-Density BGA Assembly – PCB SMT Specialists

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Overview

High-density BGA assemblies—multiple BGAs on a single board, fine-pitch packages, and complex PCB layouts—demand exceptional process control. Studio Electronics offers High-Density BGA Assembly with specialized capability for complex, multi-BGA boards. As a premier provider of PCB assembly in China, our 12 automated SMT lines, advanced X-Ray inspection systems, and experienced process engineering team deliver reliable assemblies for the most complex BGA configurations. From component procurement through final shipping, our complete turnkey service ensures every BGA is placed accurately, soldered reliably, and verified with 100% X-Ray inspection.

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

High-Density BGA Assembly Capabilities
Capability Specification Quality Control
Multiple BGAs per Board Up to 10+ BGAs per assembly 100% X-Ray on every board; individual BGA analysis
Mixed BGA Types Fine-pitch, large, micro, various package types Optimized reflow per BGA type; customized inspection
BGA + Other Components Combined with QFN, QFP, 01005 passives Comprehensive SMT capability; AOI for visible components
Board Size Small to large format PCBs 12 SMT lines with flexible board handling
Package Types PBGA, CBGA, CCGA, Micro BGA Process optimization per package; X-Ray verification

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Our High-Density BGA Assembly Process

Stage 1: Component Sourcing & Engineering Review
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Engineering review identifies BGA type variations and recommends process parameters.

Stage 2: Solder Paste Application
Precision stencil design with optimized aperture geometry. 3D SPI ensures consistent paste deposition across all BGA pads.

Stage 3: SMT Assembly (Multiple BGAs)
12 automated SMT lines with ±25μm accuracy. Sequential or simultaneous BGA placement optimized for board layout. Vision systems ensure precise alignment.

Stage 4: Controlled Reflow
Reflow profiles optimized for multiple BGA types on the same board. Thermal balancing ensures consistent soldering across all BGAs. Nitrogen reflow available.

Stage 5: 100% X-Ray Inspection
Comprehensive X-Ray verification per BGA: 2D imaging for ball alignment and bridging; 3D void analysis with automated void calculation. Inspection records per board serial number.

Stage 6: Quality Verification
ICT and Flying Probe testing; FCT for functional verification; AOI for visible components. Reliability lab testing available.

Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics.

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Why Choose Studio for High-Density BGA Assembly?

  • Multi-BGA Expertise – Experience with complex, high-density BGA configurations

  • 100% X-Ray Inspection – Every BGA on every board verified

  • Advanced Equipment – 12 SMT lines; 3D X-Ray void analysis

  • Complete Turnkey – Sourcing through assembly and shipping—one point of contact

  • Low Volume Support – Competitive pricing for low volume PCB assembly

Studio delivers High-Density BGA Assembly—PCB SMT specialist for complex, multi-BGA boards with full X-Ray verification.

Send your message to this supplier
Send Now

High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Ask Latest Price
Watch Video
Product Detail
MOQ :
No MOQ
Place of Origin :
China
Supply Ability :
100,000 pieces/month
Packaging Details :
ESD Protective Packaging/Customization
Delivery Time :
5-25 working days(varies by product)
Price :
Quote based on your specs
Contact Supplier
video
High Density BGA Assembly PCB SMT Assembly Small To Large Format PCBs

Studio Technology Co., Ltd.

Verified Supplier
1 Years
guangdong, dongguan
Since 2003
Business Type :
Manufacturer
Main Products :
Turnkey PCBA, Turnkey PCB Assembly, Turnkey PCB Manufacturing
Total Annual :
30000000-40000000
Employee Number :
300~500
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products BGA Assembly
MachineU China Products Machinery Production line Assembly line
Contact Supplier
Submit Requirement