BGA projects often start small—prototype validation, pilot production, market testing—before scaling to volume. Studio Electronics offers Low-Volume BGA Assembly supporting every stage from prototype through production. As a versatile provider of PCB assembly in China, we apply the same specialized BGA expertise—process optimization, X-Ray verification, and quality control—to every quantity, from 1 board to production volumes. Our 12 automated SMT lines and advanced inspection deliver reliable BGA assemblies throughout your product lifecycle.

Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported with competitive pricing.

Stage 2: SMT Assembly
12 SMT lines with quick-changeover. BGA placement with ±25μm accuracy. Vision alignment ensures accurate ball-to-pad registration.

Stage 3: Controlled Reflow
Custom reflow profiles optimized per BGA type. Nitrogen reflow available. Real-time temperature monitoring.

Stage 4: X-Ray Inspection (100% Coverage)
2D and 3D X-Ray on every BGA board. Void analysis; automated void calculation. Inspection results per board serial number.

Stage 5: Testing & Final Assembly
ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.

• Stage-of-Life Support – Prototype through production—one partner for the entire journey

• BGA Specialized Expertise – Process optimization per BGA type

• Flexible Quantities – No MOQ; efficient small-batch production

• Consistent Quality – 100% X-Ray regardless of quantity

• Complete Turnkey – Sourcing through assembly and shipping—all under one roof

Studio delivers Low-Volume BGA Assembly—prototype to production with 100% X-Ray verification on every BGA board.