• Front electrode blocks light, resulting in lower light emission efficiency
• Insulating adhesive used for die bonding leads to reduced heat dissipation
• Requires gold wire electrical connections, resulting in lower reliability
• Lower operating current and power capabilities

• Bottom-mounted electrodes don't block light, providing higher emission efficiency
• Metal electrodes enable superior heat dissipation
• Full-surface metal electrode connections ensure high reliability
• Operates efficiently at both low and high current levels

• Easy component transfer and rework capabilities
• Pixel-independent design

• Larger size limits ultra-fine pitch possibilities
• Requires secondary transfer, reducing efficiency
• Limited impact resistance and protection
• Additional processing steps increase costs

• Streamlined supply chain with significant cost reduction potential
• Excellent protection with waterproof and dustproof capabilities
• Enables ultra-fine and micro-pitch configurations

• Technology maturity continues to evolve

High brightness with low energy consumption - increases brightness by 20% or reduces consumption by 20% for superior heat dissipation and contrast.

Each panel includes dual backup power supplies and receiving cards. If one component fails, the backup ensures continuous panel operation.

No external cables between cabinets. Internal cable connections provide stable signal and power transmission with clean, streamlined appearance.

COB packaging industry-first 300×168.75mm modules

LVDS signal transmission is faster and more stable with over 10x speed increase

Module-level monitoring of temperature, voltage, and bit error rate with comprehensive data feedback

Non-reflective screen with 20,000:1 contrast ratio for true color reproduction

Three-in-one highly integrated design with finished box thickness <30mm and weight ≈3.5Kg/box

• Ink Consistency Three-dimensional packaging structure solves ink color consistency issues
• Seamless Effect Bridged ultra-high precision cutting (±5um accuracy)
• Static Consistency New coating process and materials eliminate white lines and color misalignment
• Display Quality Miniaturized chips with proprietary hybrid BIN algorithm
• Low Failure Rate Unique thermostatic pressure-sensitive technology protects chip solder joints

• Fully automated workshops minimize human error
• Automated repair equipment achieves zero defective shipments
• Over 95% yield rate
• COB packaging industry's thinnest: ≤30mm
• Ultralight design: ≤4.2Kg
• Multi-scenario applications: Flat, curved, semi-box, and right-angle shapes
• Batch backup: No A/B board distinction
• Open Ecosystem: Supports Nova and Color-light systems

• Optical testing instrument BM-7
• Five-axis optical equipment CS2000A
• CM-25CG color measurement
• Spectrometer analysis
• Reflectance/Transmittance measurement

• Thermal shock testing
• Constant temperature and humidity testing
• High temperature test chamber
• Salt spray test chamber
• Packaging drop testing

• X-Ray inspection
• Metallurgical microscope analysis
• FTIR spectroscopy
• SEM & EDS analysis