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TO63-03A Hermetic Sealing Package for Power Devices
TO63-03A Hermetic Sealing Package for Power Devices
Specifications
Brand Name :
HUONA
Model Number :
top
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
100
Price :
Bargain
Payment Terms :
T/T
Supply Ability :
100000 A WEEK
Delivery Time :
A WEEK
Packaging Details :
Case
Housing Material :
Kovar alloy or 304 stainless steel
Number of Pins :
3 pins (customizable to 4, 6,8 etc.)
Plating Options :
Nickel, Gold (0.5–2μm thickness)
Glass Insulator :
Borosilicate or high-insulation custom glass
Hermeticity :
≤1×10⁻⁸ atm·cc/sec (He leak test)
Dimensional Customization :
Available upon customer drawings
Description

Product Overview

Product Name: TO63-03A Hermetic Sealing Package
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials:

  • Housing: Kovar alloy (Fe-Ni-Co) or stainless steel

  • Pins: Kovar, Dumet, or custom conductive materials

  • Insulation Medium: Borosilicate or high-insulation glass

Key Features & Advantages

  • Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications

  • Wide temperature range from -55°C to +300°C for use in extreme environments

  • Strong mechanical structure with high resistance to vibration and shock

  • Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices

  • Full customization available: pin configuration, plating thickness, housing size, materials, etc.

Technical Specifications (Customizable)

Item Specification / Range
Housing Material Kovar alloy or 304 stainless steel
Number of Pins 3 pins (customizable to 4, 6,8 etc.)
Plating Options Nickel, Gold (0.5–2μm thickness)
Glass Insulator Borosilicate or high-insulation custom glass
Hermeticity ≤1×10⁻⁸ atm·cc/sec (He leak test)
Operating Temp. -55°C to +300°C
Surface Finish Nickel plated, gold plated, or blackened
Dimensional Customization Available upon customer drawings
Packaging Vacuum sealed, anti-static bag, foam tray

Application Fields

  • Laser diode and VCSEL packaging

  • Infrared sensor and detector modules

  • Power electronics: IGBT, MOSFET, and high-current transistors

  • RF and microwave device packaging

  • Medical sensor modules requiring hermetic enclosures

  • Aerospace, defense, and industrial electronics

Available Documentation & Support

  • 2D/3D drawings in PDF or STEP format

  • Helium leak and material composition reports

  • RoHS and REACH compliance certificates

  • OEM/ODM customization available from prototype to volume

  • Technical consulting for packaging layout, sealing process, and thermal design

  • Our R & D department design your product following your own specifcations

    TO63-03A Hermetic Sealing Package for Power Devices
    TO63-03A Hermetic Sealing Package for Power Devices
    TO63-03A Hermetic Sealing Package for Power Devices

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TO63-03A Hermetic Sealing Package for Power Devices

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Product Detail
Brand Name :
HUONA
Model Number :
top
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
100
Price :
Bargain
Contact Supplier
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TO63-03A Hermetic Sealing Package for Power Devices

Huona (Shanghai) New Material Co., Ltd.

Verified Supplier
1 Years
shanghai, shanghai
Since 2008
Business Type :
Manufacturer, Exporter
Main Products :
Low Expansion Alloy, Soft Magnetic Alloy, Elastic Alloy
Total Annual :
8000000-100000000
Employee Number :
100~120
Certification Level :
Verified Supplier
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