| Type | Structure | Typical Applications |
|---|---|---|
| 1-N-1 | 1 HDI layer sequence | Wearables, Basic IoT |
| 2-N-2 | 2 HDI layers per side | Smartphones, Tablets |
| Any-layer | Micro-vias on all layers | High-end CPUs, GPUs, 5G Modules |
| ELIC | Every Layer Interconnect | Aerospace, Medical Implants |

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