This custom multi-panel PCB is specifically engineered for 2.4G/5G WiFi modules, built on high-quality FR-4 substrate with ENIG (Electroless Nickel Immersion Gold) surface finish. It features high-density routing and gold-plated pads, ensuring low signal loss, excellent solderability, and long-term reliability for IoT, smart home, and wireless communication devices. The multi-panel design optimizes manufacturing efficiency and reduces per-unit costs, making it ideal for mass production of compact wireless modules.
Documents Required for Custom High-Density PCB
1. Gerber files (RS-274X): Complete PCB layout with all layers, the core production file.
2. Drill file: Detailed hole size/position for drilling processes.
3. BOM list: Clear specs of materials, surface finish and technical requirements.
4. Design drawing: Marked dimensions, tolerance and assembly notes for confirmation.

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PCB Quality Testing

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