Xingqiang Circuit Technology specializes in custom PCBs like these high density boards. Our proprietary black solder mask and gold-plated transmission lines are engineered for superior RF performance, while our flexible manufacturing allows quick iterations and low-to-high volume production. Whether for communication or industrial applications, we deliver precision-engineered, corrosion-resistant PCBs that align perfectly with your unique design requirements.
1.Microvias:
• Description: Small vias (typically in diameter) created by laser drilling. They are crucial for connecting layers in a high-density environment.
• Function: Enables high connection density and complex routing in a small area.
2. Blind and Buried Vias:
• Description: Vias that do not pass through the entire board (blind) or only connect internal layers (buried).
• Function: Saves valuable surface space and internal routing area compared to traditional through-holes.
3. Finer Lines and Spaces:
• Description: The trace width and the space between traces are significantly reduced, often to .
• Function: Allows for more traces to be routed in a given area, increasing the density.
4. Higher Component Density:
• Description: Due to the fine pitch features and microvias, more components (especially high pin count devices like BGAs) can be placed and connected on a smaller board footprint.
• Function: Essential for modern portable and high-performance electronic devices (e.g., smartphones, wearables).
• Gerber Files (RS‑274X): Core layer artwork files defining traces, pads, solder mask, silkscreen and fine circuit patterns.
• Layer Stack‑Up Drawing: Defines dielectric thickness, copper weight and layer sequence for HDI construction.
• BOM (Bill of Materials): Lists all electronic components, specifications and quantities for assembly.

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