4 Layer High Temperature Resistant OSP PCB
High temperature resistant OSP black oil double panel PCB is a double-sided printed circuit board integrating high temperature resistant performance, OSP (Organic Solderability Preservative) surface treatment, and a black solder mask. It adopts a double-sided wiring design: the substrate is made of high temperature resistant materials (such as high Tg FR-4), and the surface is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers good light-shielding properties. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for circuits operating in high temperature environments (typically above 130℃) and adapts to the welding needs of conventional and precision components.
Key Advantages of Multilayer PCB Circuit Boards
| Item |
Description |
| Board Type |
Custom Multilayer Printed Circuit Board |
| Layers |
4-layer / 6-layer optional |
| Base Material |
FR-4 high TG glass fiber epoxy |
| Surface Finish |
ENIG (Nickel Gold), HASL Lead-free, OSP |
| Solder Mask |
Green / Black solder mask |
| Temperature Resistance |
Operating: -40℃ to +85℃
Reflow soldering: up to 260℃ |
| Application |
LED display, industrial control, automotive electronics, communications |
| Custom Service |
Gerber file customization, prototype & mass production |
| Quality Standard |
RoHS compliant, IPC standard, stable & reliable |
Custom Multilayer PCB Manufacturing & Full Production Process
- Receive customers’ Gerber files and BOM lists, conduct professional DFM review and design optimization to ensure manufacturability, stability and cost-effectiveness.
- Perform material cutting, inner-layer circuit imaging, etching and automated optical inspection to guarantee high precision.
- Complete lamination, precision drilling, electroplating and outer-layer pattern formation for reliable multilayer structure.
- Apply solder mask coating, surface finishing (ENIG/HASL/OSP) and silkscreen printing for protection and identification.
- Carry out electrical testing, AOI, reliability verification and full quality control.
- Provide safe packaging and on-time delivery supporting both rapid prototyping and mass production.

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