Cost-effective Piezo Jet Valve in CCM/VCM/PCB Adhesive Dispensing applications

Piezoelectric jet valves offer precise, non-contact dispensing for CCM, VCM, PCBs, micro vibration motors, and speakers. Ideal for high-density assemblies, they ensure consistent dot volume, high speed, and reliability. Supporting a wide viscosity range, they enable accurate adhesive, solder paste, and underfill application, boosting efficiency and quality in advanced electronics manufacturing.

Core Advantages

1. Easy to disassemble and assemble: quick disassembly flow channel, easy to quickly disassemble and clean the flow channel
2. Convenient maintenance: top calibration + nozzle adjustment-free
3. Supports fast switching of 10 channel process parameters
4. Precision glue control mode, more accurate glue spraying, and stable control of small glue volume
5. Valve body detection and alarm function
6. Visual fault management

Main appliaction

• CCM (mobile phone camera module)
  Application: lens fixing, filter packaging, autofocus structure bonding, etc.

• VCM (voice coil motor)
  Application: autofocus components, coil bonding, magnet fixing

• PCB (printed circuit board)
  Application: SMT packaging, component fixing, welding pre-processing

• Micro vibration motor (for mobile phones and other portable devices)
  Application: motor structure bonding, fixed shockproof

• Micro speaker (receiver, speaker, etc.)
  Application: diaphragm fixing, structure bonding, waterproof sealing

• Optical communication module
  Application: optical device packaging, chip bonding, thermal management material coating

Technical parameters

FAQ

Q1: Can the piezo jet valve handle high-viscosity hot melt adhesives used in speaker assembly?
A1: Yes. Piezo jet valves are engineered to dispense hot melt adhesives with viscosities up to 50,000 mPa·s. Equipped with heating modules for the valve and tank, they maintain consistent temperature and flow, ensuring stable jetting performance during speaker diaphragm or frame bonding.

Q2: How does the valve prevent overflow or glue defects on small speaker components?
A2: With non-contact, micro-precision dispensing, piezo valves ensure uniform dot size and placement even in narrow bonding areas. This minimizes glue overflow and improves cosmetic appearance and acoustic reliability in TWS and smartphone speaker modules.

Q3: How is nozzle condition maintained during continuous high-speed operation?
A3: The valve includes heating and sealing components to prevent clogging and carbonization. Routine cleaning is simple, and the design minimizes nozzle wear, ensuring stable performance for long production runs.

About Mingseal

Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.

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