High accurancy Piezoelectric Jetting Valve System for underfill process in Advanced packaging

Mingseal’s KPS2000-KS piezo jet valve is optimized for high-precision underfill applications in advanced semiconductor packaging. Featuring a refined valve body structure and nanoliter-level dispensing control, it ensures excellent dot consistency, reduced voids, and improved capillary flow for flip chip and wafer-level packages. Its non-contact jetting design supports high-speed, automated underfill processes with superior accuracy and repeatability.

Core Advantages

• Non-contact injection, high frequency, high response
• Micro-precision control, nanoliter glue volume control, high glue consistency
• High-precision valve body structure and flow channel design to ensure consistency and guarantee packaging yield
• The temperature control system can be integrated to maintain a constant glue temperature, improve capillary flow efficiency, speed up bottom filling, and adapt to chips of different sizes.

Main appliaction

• Edge Underfill
• Corner Fill / Pre-dispense
• Local repair glue

Technical parameters

FAQ

Q1: Can piezo jet valves handle low-viscosity underfill materials used in flip chip packaging?
A1: Yes. Piezo jet valves, such as the Mingseal KPS2000-KS, are specifically designed to dispense low-viscosity underfill materials with nanoliter precision. They support smooth, consistent flow and precise control, essential for capillary-driven underfill processes.

Q2:How does the valve ensure consistent dot volume during long production runs?
A2: The valve features a high-precision nozzle structure and optimized flow path to ensure repeatable dot volumes with deviation less than ±2%. Closed-loop control and high-frequency actuation maintain uniform performance even during high-speed, continuous operation.

About Mingseal

Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a technology-driven manufacturer of high-end equipment, specializing in connection, assembly, inspection systems, and key components for advanced semiconductor packaging and precision electronics. Our solutions are widely adopted by leading customers in sectors such as semiconductor packaging, consumer electronics, and automotive electronics. With a strong presence across Asia and the Americas, we deliver reliable support and innovation globally.

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