3in1 Release Film for RF-PCB Lamination
Product application:
3in1 Release Film is suitable for filling and covering during the compression or lamination process of soft and hard circuit board (Rigid and Flexible PCB/RF-PCB).
Product Structure:
Release layer
Product Features:
1. It has better temperature resistance.
2. It can meet the height difference of different soft and hard boards.
3.It features better dimensional expansion and contraction stability after compression or lamination.
4. It can match with different specifications and sizes of core layers.
3in1 Release Film Types:
Model | Thickness | Structure | Surface finish |
ESRF-3in1 | 25-500um |
3 layers
|
Matte or glossy |