Lamination Pad & Hot Press Cushion Pad for sale - Eaststar New Material (Tianjin) Limited

EastStar New Material (Tianjin) Limited (hereinafter referred to as EastStar) is well known as a high-tech enterprise specializing in serving such industries as PCB, CCL, semiconductor, woodworking and new energy, etc. EastStar has been specializing in the professional research, development, production and sales of lamination materials and consumables to be used in the relevant products lamination process. Quality is the foundation of a company's existence. EastStar has a group of high-quality R&D and process talents in the fields of polymer chemistry and...

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Lamination Pad

50 products available

2220 X 1270mm Lamination Pad Customized Size Copper Clad Lamination Pad 4mm Press Rubber

Specialized PCB Silicon Lamination Pad Kraft Paper Replacement

White Rectangular CCL Buffering Pad CCL Hot Press Cushion Pad Mat

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Hot Press Cushion Pad

26 products available

4mm - 6.5mm Hot Press Cushion Pad High Temperature Resistance Rigid PCB Press Cushion Pad

Industrial Grade Thermal Pad PCB ±0.3mm Tolerance Rubber Hot Press Cushion Pad

Flexible FPCB Hot Press Cushion Pad Bendable PCB Cushion Mat Press Pad

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Lamination Press Rubber Pad

23 products available

Polymer Rigid PCB Press Pad Rigid PCB Cushion Mat Buffering Hot Press Cushion

1.5 - 2.0mm FPC Press Pad Flexible Ccl PCB Printed Core Board Cushion Pad

2220x1270mm Lamination Press Rubber Pad Customized Size Copper Clad Laminate Sheet

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Wood Press Cushion Pad

21 products available

High Temperature Resistant 2.5N/Mm Wood Press Cushion Pad Silicone Rubber For Wood Industry

1.5 - 2.5mm Silicon Rubber Wood Press Cushion Pad For Wood Industry

3.0mm Grey Wood Press Cushion Pad Suction Film Lamination Cushion Press Pad

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Solar Rubber Cushion pad

11 products available

Hardness 70 Glossy Matte Photovoltaic Module Cushion Pad PV Buffering High Temp Resistant

2000 - 6000 Times Solar Rubber Cushion Pads Photovoltaic Panel Lamination For PV Modules

Customized Size Tight Bond Solar Rubber Cushion Pad Photovoltaic Panel Lamination Pad

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Printed Circuit Board Laminate Plate

11 products available

NAS630 NAS301 Printed Circuit Board Laminate Plate Pcb Laminate 1500 X 1295

SUS301H PCB Lamination Steel Plate 1500 X 1295 Thin Press Plate

Dura420 1.0mm - 2.0mm Pcb Laminate High Precision PCB Lamination Steel Plate

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Eaststar New Material (Tianjin) Limited

Flexible And Elastic Lamination Pad with High Wear Resistance and Hypoallergenic CCL Cushion Mat

Thickness Tolerance ±0.3mm Lamination Pad with Nano High Temperature Resistant Coating and Hypoallergenic Properties for Pressure Distribution

Water absorption below 8% Hot Press Cushion Pad with Buffer Standard ≥ 12% and Tensile Strength ≥ 25 MPa for PCB Lamination

Nano High Temperature Resistant Lamination Pad with 100mm x 100mm Dimensions and Smooth Surface Texture for CCL Cushion Mat Applications

High Wear Resistance Lamination Pad with Thickness Tolerance ±0.3mm and Buffer Standard ≥ 12% for Heavy Duty

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥25 MPa and Buffer Standard ≥12% for Rigid PCB Lamination

High Wear Resistance Lamination Pad with Nano High Temperature Resistant Coating and Hypoallergenic CCL Cushion Pad

1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination

Hypoallergenic Flexible and Elastic Lamination Pad with Nano High Temperature Resistant Coating for Enhanced Durability

300-500 Times Service Life High Temperature Resistance ≤280℃ Square Hot Press Cushion Pad for PCB Lamination

Eaststar New Material (Tianjin) Limited

Lamination Pad

Hot Press Cushion Pad

Lamination Press Rubber Pad

Popular Categories

Lamination Pad

2220 X 1270mm Lamination Pad Customized Size Copper Clad Lamination Pad 4mm Press Rubber

Specialized PCB Silicon Lamination Pad Kraft Paper Replacement

White Rectangular CCL Buffering Pad CCL Hot Press Cushion Pad Mat

Hot Press Cushion Pad

4mm - 6.5mm Hot Press Cushion Pad High Temperature Resistance Rigid PCB Press Cushion Pad

Industrial Grade Thermal Pad PCB ±0.3mm Tolerance Rubber Hot Press Cushion Pad

Flexible FPCB Hot Press Cushion Pad Bendable PCB Cushion Mat Press Pad

Lamination Press Rubber Pad

Polymer Rigid PCB Press Pad Rigid PCB Cushion Mat Buffering Hot Press Cushion

1.5 - 2.0mm FPC Press Pad Flexible Ccl PCB Printed Core Board Cushion Pad

2220x1270mm Lamination Press Rubber Pad Customized Size Copper Clad Laminate Sheet

Wood Press Cushion Pad

High Temperature Resistant 2.5N/Mm Wood Press Cushion Pad Silicone Rubber For Wood Industry

1.5 - 2.5mm Silicon Rubber Wood Press Cushion Pad For Wood Industry

3.0mm Grey Wood Press Cushion Pad Suction Film Lamination Cushion Press Pad

Solar Rubber Cushion pad

Hardness 70 Glossy Matte Photovoltaic Module Cushion Pad PV Buffering High Temp Resistant

2000 - 6000 Times Solar Rubber Cushion Pads Photovoltaic Panel Lamination For PV Modules

Customized Size Tight Bond Solar Rubber Cushion Pad Photovoltaic Panel Lamination Pad

Printed Circuit Board Laminate Plate

NAS630 NAS301 Printed Circuit Board Laminate Plate Pcb Laminate 1500 X 1295

SUS301H PCB Lamination Steel Plate 1500 X 1295 Thin Press Plate

Dura420 1.0mm - 2.0mm Pcb Laminate High Precision PCB Lamination Steel Plate

New Products

Black Hypoallergenic Lamination Pad with Nano High Temperature Resistant Coating for Flexible and Elastic Cushioning

Industrial Lamination Pad with Nano High Temperature Resistant Coating Hypoallergenic and High Wear Resistance for CCL Cushion Mat

Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for 300-500 Times Service Life in PCB Lamination

Smooth Surface Texture Lamination Pad with Nano High Temperature Resistant Coating and Flexible Elastic Design for Enhanced Comfort

Hypoallergenic Lamination Pad with ±0.3mm Thickness Tolerance and Nano High Temperature Resistant Coating for CCL Applications

Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for PCB Lamination with ≤280℃ High Temperature Resistance

Hot Press Cushion Pad with ≥ 12% Buffer Standard, ≤280℃ High Temperature Resistance, and ≥ 25 MPa Tensile Strength for PCB Lamination

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for Rigid PCB Lamination

High Temperature Resistant Hot Press Cushion Pad with Tensile Strength ≥ 25 MPa and Water Absorption < 8% for PCB Lamination

Wood Press Cushion Pad with 350% Elongation at Break, Tensile Strength ≥ 80 N/mm, and 1.5-2.5mm Thickness for Wood Lamination