Eaststar New Material (Tianjin) Limited
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2 Years
tianjin, tianjin
Since 2018
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Supplier Homepage > Products > Hot Press Cushion Pad

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Lamination Pad

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Hot Press Cushion Pad

 (26)

Lamination Press Rubber Pad

 (23)

Wood Press Cushion Pad

 (21)

Solar Rubber Cushion pad

 (11)

Printed Circuit Board Laminate Plate

 (11)

Copper Clad Laminate Plate

 (13)

Carrier Cover Plate

 (15)

Heat Press Kraft Paper

 (10)

Laminating Film Roll

 (27)

Wafer Frame Ring

 (14)
Product Categories

Hot Press Cushion Pad

26
Choose from our hot press cushion pad products, find out more, and feel free to inquiry us
4mm - 6.5mm Hot Press Cushion Pad High Temperature Resistance Rigid PCB Press Cushion Pad
Hot selling!
Hot Press Cushion Pad

4mm - 6.5mm Hot Press Cushion Pad High Temperature Resistance Rigid PCB Press Cushion Pad
Model：ESCP-PCB-G2
MOQ：50pcs
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Industrial Grade Thermal Pad PCB ±0.3mm Tolerance Rubber Hot Press Cushion Pad
Hot selling!
Hot Press Cushion Pad

Industrial Grade Thermal Pad PCB ±0.3mm Tolerance Rubber Hot Press Cushion Pad
Model：ESCP-FPC-G3
MOQ：20pcs
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Flexible FPCB Hot Press Cushion Pad Bendable PCB Cushion Mat Press Pad
Hot selling!
Hot Press Cushion Pad

Flexible FPCB Hot Press Cushion Pad Bendable PCB Cushion Mat Press Pad
Brand Name：ES
Place of Origin：CHINA
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1.5mm - 2.0mm FPC Press Pad Silastic Flexible PCB Cushion Pad
Hot Press Cushion Pad

1.5mm - 2.0mm FPC Press Pad Silastic Flexible PCB Cushion Pad
Model：ESCP-FPC-G3
MOQ：50PCS
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Comprehensive Lightweight Hot Press Cushion Pad Printed Circuit Board Buffering Pad
Hot Press Cushion Pad

Comprehensive Lightweight Hot Press Cushion Pad Printed Circuit Board Buffering Pad
Supply Ability：400pcs per day
MOQ：200pcs
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FPC Copper Clad Laminate Integrate FPCB Cushion Pad Buffering Pad Hot Press
Hot Press Cushion Pad

FPC Copper Clad Laminate Integrate FPCB Cushion Pad Buffering Pad Hot Press
Place of Origin：CHINA
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Buffering 1.5 - 2mm Hot Press Cushion Pad Water Absorption Rate 8% Pcb Laminate
Hot Press Cushion Pad

Buffering 1.5 - 2mm Hot Press Cushion Pad Water Absorption Rate 8% Pcb Laminate
Model：ESCP-FPC-G3
MOQ：20pcs
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Rigid Multilayer PCB Press Cushion Pad Flexible Copper Clad Pcb Board
Hot Press Cushion Pad

Rigid Multilayer PCB Press Cushion Pad Flexible Copper Clad Pcb Board
Model：ESCP-PCB-G2
MOQ：20pcs
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Chemical Resistanct Grey Hot Press Cushion FPCB Pad Circuit Board Laminate Materials
Hot Press Cushion Pad

Chemical Resistanct Grey Hot Press Cushion FPCB Pad Circuit Board Laminate Materials
Model：ESCP-FPC-G3
MOQ：20pcs
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High Molecular Weight Polymer PCB Press Cushion Pad Rectangular Copper Clad Pcb
Hot Press Cushion Pad

High Molecular Weight Polymer PCB Press Cushion Pad Rectangular Copper Clad Pcb
Model：ESCP-FPC-G3
MOQ：20pcs
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Red Hot Press Cushion Pad 100 - 200 Times Circuit Board Laminate
Hot Press Cushion Pad

Red Hot Press Cushion Pad 100 - 200 Times Circuit Board Laminate
Model：ESCP-FPC-G3
MOQ：20pcs
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Water Absorent FPC Cushion Mat 25MPa Flexible Copper Clad Laminate
Hot Press Cushion Pad

Water Absorent FPC Cushion Mat 25MPa Flexible Copper Clad Laminate
Model：ESCP-FPC-G3
MOQ：20pcs
Contact Now
FPC Flexible Hot Press Cushion Pad 25 MPa Smooth Flexible Copper Clad Laminate
Hot Press Cushion Pad

FPC Flexible Hot Press Cushion Pad 25 MPa Smooth Flexible Copper Clad Laminate
Model：ESCP-FPC-G3
MOQ：20pcs
Contact Now
Hot Press Lightweight FPCB Cushion Pad FPC Lamination Press Pad Buffering Cushion Mat
Hot Press Cushion Pad

Hot Press Lightweight FPCB Cushion Pad FPC Lamination Press Pad Buffering Cushion Mat
Place of Origin：CHINA
Contact Now
Temperature Resistant Hot Press Cushion Pad 4mm - 6.5mm PCB Press Cushion Mat
Hot Press Cushion Pad

Temperature Resistant Hot Press Cushion Pad 4mm - 6.5mm PCB Press Cushion Mat
Model：ESCP-PCB-G2
MOQ：20pcs
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Water absorption below 8% Hot Press Cushion Pad with Buffer Standard ≥ 12% and Tensile Strength ≥ 25 MPa for PCB Lamination
Hot Press Cushion Pad

Water absorption below 8% Hot Press Cushion Pad with Buffer Standard ≥ 12% and Tensile Strength ≥ 25 MPa for PCB Lamination
Model：ESCP-PCB-G2
MOQ：10pcs
Contact Now
High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥25 MPa and Buffer Standard ≥12% for Rigid PCB Lamination
Hot Press Cushion Pad

High Temperature Resistance ≤280℃ Hot Press Cushion Pad with Tensile Strength ≥25 MPa and Buffer Standard ≥12% for Rigid PCB Lamination
Model：ESCP-PCB-G2
MOQ：10pcs
Contact Now
1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination
Hot Press Cushion Pad

1170 by 690 millimeter Hot Press Cushion Pad with Heat Resistance ≤280℃ and Buffer Standard ≥12% for PCB Lamination
Model：ESCP-PCB-G2
MOQ：10pcs
Contact Now
300-500 Times Service Life High Temperature Resistance ≤280℃ Square Hot Press Cushion Pad for PCB Lamination
Hot Press Cushion Pad

300-500 Times Service Life High Temperature Resistance ≤280℃ Square Hot Press Cushion Pad for PCB Lamination
Model：ESCP-PCB-G2
MOQ：10pcs
Contact Now
Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for 300-500 Times Service Life in PCB Lamination
Hot Press Cushion Pad

Hot Press Cushion Pad with ≥ 25 MPa Tensile Strength and ≥ 12% Buffer Standard for 300-500 Times Service Life in PCB Lamination
Model：ESCP-PCB-G2
MOQ：10pcs
Contact Now
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