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unshielded dip power inductor LanTu Micro SPK0810-151MB for spike suppression and power applications
unshielded dip power inductor LanTu Micro SPK0810-151MB for spike suppression and power applications
Specifications
Current Rating :
720mA
Wire Diameter :
0.65mm
Inductance :
150uH
Frequency - Self Resonant :
3.7MHz
Tolerance :
±20%
DC Resistance(DCR) :
240mΩ
Type :
Drum-core inductor
Q @ Frequency :
30@796kHz
Description :
720mA 150uH ±20% 240mΩ Drum-core inductor Through Hole,D9xL13mm Fixed Inductors RoHS
Mfr. Part # :
SPK0810-151MB
Model Number :
SPK0810-151MB
Package :
Through Hole,D9xL13mm
Description

Unshielded DIP Power Inductors - SPK Series

Product Overview
The SPK Series Unshielded DIP Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for spike suppression and general power applications. These inductors offer a low-cost solution with high power handling, high saturation, and low resistance. Their unshielded construction, coupled with core encapsulation in UL heat shrink tubing, provides excellent mechanical and environmental protection. Available in various package sizes and a wide inductance range, they are suitable for automated insertion processes. The SPK series is RoHS, Halogen Free, and REACH compliant, making them a reliable choice for modern electronic designs.

Product Attributes

  • Brand: LANTU
  • Origin: SHENZHEN
  • Product Series: SPK
  • Type: Unshielded DIP Power Inductor, Spike suppression coil
  • Certifications: RoHS, Halogen Free, REACH Compliance
  • Packaging Options: Tape packaging for auto-insertion, Bulk Package

Technical Specifications

Model Inductance Range Dimensions (L x W x H, mm) Operating Temperature Inductance Tolerance
SPK0406 1.0 H to 563 H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK0608 3.3 H to 154 H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK0707 1.0 H to 152 H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK0807 2.2 H to 152 K H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK0810 3.3 H to 104 H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK0912 1.0 H to 333 H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK1010 3.3 H to 153 K H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK1012 3.3 H to 393 K H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK1016 4.7 H to 103 K H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)
SPK1018 4.7 K H to 104 K H (Refer to Shape and Dimensions table) -40 to +125 K (10%)
SPK1213 10 M H to 103 K H (Refer to Shape and Dimensions table) -40 to +125 M (20%), K (10%)

Applications

  • TVs and Audio equipment
  • Telecommunication devices
  • Noise filters
  • Chargers, fast charge
  • DC/DC converters

Test Equipment Used

  • Inductance (L): HP4284A, HP4285A LCR meter or equivalent
  • Saturation Current (Isat) & RMS Current (Irms): HP4284+42841A or equivalent
  • Self-Resonant Frequency (SRF): HM 9461 or equivalent
  • Quality Factor (Q): HP4285A or equivalent
  • DC Resistance (DCR): Chroma 16502 or equivalent

Shape and Dimensions (mm)

Part No A (Max) B (Min) C () D (Max) E () F H
SPK0406 8.0 15.0 2.0 5.0 0.55 0.85 2.0
SPK0608 11.0 15.0 2.5 7.0 0.65 0.95 2.5
SPK0707 9.5 15.0 5.0 8.0 0.65 0.95 5.0
SPK0807 9.5 15.0 5.0 9.0 0.65 0.95 5.0
SPK0810 13.0 15.0 5.0 9.0 0.65 0.95 5.0
SPK0912 15.0 15.0 5.0 10.0 0.80 1.1 5.0
SPK1010 13.0 15.0 5.0 12.0 0.80 1.1 5.0
SPK1012 15.0 15.0 6.0 12.0 0.80 1.1 6.0
SPK1016 19.0 15.0 6.0 12.0 0.80 1.1 6.0
SPK1018 21.0 15.0 6.0 12.0 0.80 1.1 6.0
SPK1213 16.0 15.0 7.5 14.0 0.80 1.1 7.5

Product Identification

SPK 0608 503 K TF

  • SPK: Type
  • 0608: External Dimensions (L x H) (mm)
  • 503: Inductance (50 mH)
  • K: Inductance Tolerance (e.g., J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%)
  • TF: Packaging (TF: Tape)

Reliability Testing

Test Item Requirements Test Methods and Remarks
Terminal Strength (SMT/DIP) Meet requirements without loose terminals Pulling test, Solder paste thickness, Terminal diameter based force application
Resistance to Flexure No visible mechanical damage Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec
Dropping No case deformation, no short/open Drop from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each
Solderability Wetting > 75% coverage, Terminals 95% minimum solder coverage Solder temp: 2402, Duration: 3 sec, Solder: Sn/3.0Ag/0.5Cu
Vibration No visible mechanical damage, Inductance change: 10%, Q factor change: 20% 10-55 Hz frequency sweep, 2 hours in 3 perpendicular directions
Thermal Shock No visible mechanical damage, Inductance change: 10%, Q factor change: 20% 100 cycles of temperature cycling (-55~40 to 85~125)
Low Temperature Storage No visible mechanical damage, Inductance change: 10%, Q factor change: 20% -402 for 962 hours
High Temperature Storage No visible mechanical damage, Inductance change: 10%, Q factor change: 20% 852 for 962 hours
Damp Heat (Steady States) No visible mechanical damage, Inductance change: 10%, Q factor change: 20% 602, 90%-95% RH for 962 hours
Heat Endurance of Reflow Soldering Appearance normal, L/L10%, Q/Q30%, DCR/DCR10% Peak temp: 260+0/-5, Twice reflow
Resistance to Solvent Test No case deformation or obliteration of marking Dip in IPA solvent, brush 10 times
Overload Test No smoke, smell, fire; characteristics normal after test Apply twice rated current for 5 minutes
Voltage Resistance Test No breakdown; characteristics normal after test DC1000V, Current: 1mA, Time: 1Min

Reminders for Using These Products

  • Storage period within 12 months; conditions: 5~40C, 35~65% RH.
  • Avoid use/storage in corrosive gas environments (salt, acid, alkali).
  • Do not touch terminals directly with bare hands to maintain solderability.
  • Handle carefully to prevent damage from dropping or improper removal.
  • Do not bend terminals excessively to avoid wire fracture.
  • Do not rinse coils; contact manufacturer if cleaning is necessary.
  • Keep away from magnets or magnetic fields.
  • Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
  • Soldering corrections after mounting should be within specified conditions to avoid overheating.
  • Allow for sufficient thermal design margin due to self-heating when power is on.
  • For non-magnetic shield types, careful coil layout is needed to prevent malfunction due to magnetic interference.

2410121635_LanTu-Micro-SPK0810-151MB_C5127536.pdf
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unshielded dip power inductor LanTu Micro SPK0810-151MB for spike suppression and power applications

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Product Detail
Current Rating :
720mA
Wire Diameter :
0.65mm
Inductance :
150uH
Frequency - Self Resonant :
3.7MHz
Tolerance :
±20%
DC Resistance(DCR) :
240mΩ
Contact Supplier
unshielded dip power inductor LanTu Micro SPK0810-151MB for spike suppression and power applications

Beijing Silk Road Enterprise Management Services Co., Ltd.

Verified Supplier
1 Years
beijing, beijing
Since 2009
Business Type :
Manufacturer, Distributor/Wholesaler, Agent, Importer
Main Products :
Crystals, Delay Lines, Aluminum - Polymer Capacitors
Employee Number :
>>300
Certification Level :
Verified Supplier
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