Unshielded SMD Power Inductors - SCD7850 Series

Product Overview: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. presents the SCD7850 Series of Unshielded SMD Power Inductors. These low-cost, silver-plated inductors are designed for surface mounting and offer a compact size with high rated current and low DC resistance. They are ideal for DC/DC converters and power supplies in various electronic devices, including VTRs, LCD televisions, notebook PCs, and portable communication equipment. The series complies with RoHS, Halogen Free, and REACH standards.

Product Attributes

• Brand: SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD.
• Series: SCD7850
• Type: Unshielded SMD Power Inductors
• Design: Silver plated type, Low cost design
• Certifications: RoHS, Halogen Free and REACH Compliance
• Packaging Options: Bulk Package, Tape & Reel

Technical Specifications

Operating Temperature: -40 to +125 (Including coils self-temperature rise)

External Dimensions (LWH)

Electrical Characteristics & Specifications

Notes on Specifications:

• Saturation Current: DC current at which inductance drops 10% from its value without current.
• Temperature Rise Current: The actual value of DC current when the temperature rise is T 40 (Ta=25).
• Rated DC Current: The lesser value of Isat or Irms.
• Special Remind: Circuit design, component, PCB trace size and thickness, airflow, and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.

Product Identification Example

SCD 7850 - 101 K T

• Type: SCD (Unshielded SMD Power Inductors)
• Inductance: 101 (100 H)
• Tolerance: K (10%)
• Packing: T (Tape & Reel)

Test Equipment Used

• Inductance (L): HP4284A, HP4285A LCR meter or equivalent
• Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
• Self-Resonant Frequency (SRF): Agilent E4991A or equivalent
• DC Resistance (DCR): Chroma 16502 or equivalent

Packaging Details

Tape and Reel Specifications:

Reel Dimensions:

Cover tape peel off condition:

• Cover tape peel force shall be 10 to 120g
• Noodle strip peeling angle 165 to 180

Reliability Testing

Recommended Reflow Soldering Curve

The recommended reflow conditions are set according to the manufacturer's soldering equipment. Users should adjust and confirm conditions based on their specific environment and equipment.

Reminders for Using These Products

• Storage: Within 12 months, under conditions (5~40C, 35~65% RH). Terminal solderability may deteriorate beyond this period.
• Environment: Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
• Handling: Avoid direct contact with terminals by bare hands due to oil secretions that can reduce solderability. Handle carefully to prevent damage from dropping or improper removal.
• Terminals: Do not bend terminals excessively to avoid wire fracture.
• Cleaning: Do not rinse coils yourself; contact the manufacturer if cleaning is necessary.
• Magnetic Fields: Do not expose products to magnets or magnetic fields.
• Preheating: Preheat components before soldering. The temperature difference between solder and chip temperature should not exceed 150C.
• Soldering Corrections: Post-mounting soldering corrections should be within specified conditions. Overheating can lead to short circuits, performance degradation, or reduced lifespan.
• Thermal Design: Allow sufficient margin for thermal design as self-heating occurs when power is on.
• Layout: For non-magnetic shield types, carefully consider coil placement in the PCB design to prevent malfunctions due to magnetic interference.