SHANGHAI FAMOUS TRADE CO.,LTD
Verified Supplier
9 Years
shanghai, shanghai
Since 2013
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Supplier Homepage > Products > Semiconductor Equipment

PRODUCT CATEGORIES

Plastic Carrier Bags

 (1)

Sapphire Wafer

 (103)

SiC Substrate

 (163)

Sapphire Optical Windows

 (80)

IC Silicon Wafer

 (25)

Wire Saw Machine

 (18)

Synthetic Sapphire Rod

 (18)

Fused Quartz Plate

 (46)

Sapphire Parts

 (147)

Synthetic Gemstone

 (83)

Semiconductor Equipment

 (56)

LiNbO3 Wafer

 (18)

Indium Phosphide Wafer

 (34)

Ceramic Substrate

 (44)

Lab Wrapper

 (36)

Gallium Nitride Wafer

 (40)

GaAs Wafer

 (26)
Product Categories

Semiconductor Equipment

56
Choose from our semiconductor equipment products, find out more, and feel free to inquiry us
355nm/532nm/1064nm Chromatic Laser Marking System for Stainless Steel
Hot selling! video
Semiconductor Equipment

355nm/532nm/1064nm Chromatic Laser Marking System for Stainless Steel
Model：Chromatic Laser Processing Equipment
MOQ：3
Contact Now
355nm/532nm/1064nm Switchable Chromatic Laser Processing Equipment
Hot selling! video
Semiconductor Equipment

355nm/532nm/1064nm Switchable Chromatic Laser Processing Equipment
Model：High-Precision Chromatic Laser Processing Equipment
MOQ：3
Contact Now
Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components
Hot selling! video
Semiconductor Equipment

Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components
Model：Fiber Laser Marking Machine
MOQ：5
Contact Now
6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized
video
Semiconductor Equipment

6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized
Model：Laser Separation System Machine
MOQ：5
Contact Now
End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength
video
Semiconductor Equipment

End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength
Model：End-Pumped Laser Marking Machine
MOQ：5
Contact Now
CO₂ Laser Marking Machine CO₂ Laser Fully Automatic Image & Text Engraving
video
Semiconductor Equipment

CO₂ Laser Marking Machine CO₂ Laser Fully Automatic Image & Text Engraving
Model：CO₂ Laser Marking Machine
MOQ：5
Contact Now
CO₂ Laser Cutting Machine 40W-600W Positioning Accuracy±0.05mm
video
Semiconductor Equipment

CO₂ Laser Cutting Machine 40W-600W Positioning Accuracy±0.05mm
Model：CO₂ Laser Cutting Machine
MOQ：5
Contact Now
Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing
video
Semiconductor Equipment

Wafer Mounting Ring - 420 Stainless Steel Wafer Frame for Semiconductor Dicing
Delivery Time：2-4 WEEKS
MOQ：10
Contact Now
Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups
video
Semiconductor Equipment

Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups
Model：Bionic non-slip pad
Price：by case
Contact Now
Microfluidic Laser Equipment For Semiconductor Wafer Processing
video
Semiconductor Equipment

Microfluidic Laser Equipment For Semiconductor Wafer Processing
Model：Microfluidic laser equipment
MOQ：1
Contact Now
Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material
video
Semiconductor Equipment

Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material
Model：Microjet laser technology equipment
MOQ：1
Contact Now
Robotic Polishing Machine for Flat/Spherical/Aspherical Optical Components Processing
video
Semiconductor Equipment

Robotic Polishing Machine for Flat/Spherical/Aspherical Optical Components Processing
Model：Robotic Polishing Machine
MOQ：3
Contact Now
​​END PUMP LASER MARKING MACHINE 8W-40W Laser Wave Length 1064nm
video
Semiconductor Equipment

​​END PUMP LASER MARKING MACHINE 8W-40W Laser Wave Length 1064nm
Model：​​END PUMP LASER MARKING MACHINE
MOQ：5
Contact Now
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
video
Semiconductor Equipment

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
Model：Wafer Bonding Equipment
MOQ：2
Contact Now
Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity
video
Semiconductor Equipment

Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity
Model：Wafer Precision Thinning Equipment
MOQ：2
Contact Now
Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
video
Semiconductor Equipment

Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
Model：Fully Automatic Precision Dicing Saw equipment
MOQ：2
Contact Now
​​20W-200W Fiber Laser Marking Machine for Metal and Non-metal Laser Engraving​​
video
Semiconductor Equipment

​​20W-200W Fiber Laser Marking Machine for Metal and Non-metal Laser Engraving​​
Model：Fiber Laser Marking Machine
MOQ：5
Contact Now
6–8 Inch Silicon and SiC Wafer Polishing Line with Quad Heads and Closed-Loop Mounting
Semiconductor Equipment

6–8 Inch Silicon and SiC Wafer Polishing Line with Quad Heads and Closed-Loop Mounting
Delivery Time：2-4 WEEKS
MOQ：1
Contact Now
Green Laser Diamond Cutting Machine Precision Cutting for Diamond and Superhard Materials
Semiconductor Equipment

Green Laser Diamond Cutting Machine Precision Cutting for Diamond and Superhard Materials
Delivery Time：2-4 WEEKS
MOQ：1
Contact Now
SiC Sintering Furnace – High-Temperature Carbonization and Uniform Bonding Solution
Semiconductor Equipment

SiC Sintering Furnace – High-Temperature Carbonization and Uniform Bonding Solution
Delivery Time：2-4 WEEKS
MOQ：1
Contact Now
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