SHANGHAI FAMOUS TRADE CO.,LTD
Verified Supplier
8 Years
shanghai, shanghai
Since 2013
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Gallium Nitride Wafer
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IC Silicon Wafer
Synthetic Sapphire Rod
Fused Quartz Plate
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LiNbO3 Wafer
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Supplier Homepage > Products > Semiconductor Equipment

PRODUCT CATEGORIES

Gallium Nitride Wafer

 (40)

Sapphire Wafer

 (91)

SiC Substrate

 (139)

Sapphire Optical Windows

 (79)

IC Silicon Wafer

 (22)

Synthetic Sapphire Rod

 (15)

Fused Quartz Plate

 (38)

Sapphire Parts

 (108)

Synthetic Gemstone

 (77)

Semiconductor Equipment

 (52)

LiNbO3 Wafer

 (18)

GaAs Wafer

 (25)

Indium Phosphide Wafer

 (34)

Ceramic Substrate

 (25)

Lab Wrapper

 (33)
Product Categories

Semiconductor Equipment

52
Choose from our semiconductor equipment products, find out more, and feel free to inquiry us
Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components
Hot selling! video
Semiconductor Equipment

Fiber Laser Marking Machine 20W-100W for Marking on Stainless Steel/Components
Model：Fiber Laser Marking Machine
MOQ：5
Contact Now
6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized
Hot selling! video
Semiconductor Equipment

6inch-12inch SiC Substrate Laser Separation System Machine Wafers Customized
Model：Laser Separation System Machine
MOQ：5
Contact Now
End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength
Hot selling! video
Semiconductor Equipment

End-Pumped Laser Marking Machine 6W-30W High-Precision Marking 1064nm Wavelength
Model：End-Pumped Laser Marking Machine
MOQ：5
Contact Now
CO₂ Laser Marking Machine CO₂ Laser Fully Automatic Image & Text Engraving
video
Semiconductor Equipment

CO₂ Laser Marking Machine CO₂ Laser Fully Automatic Image & Text Engraving
Model：CO₂ Laser Marking Machine
MOQ：5
Contact Now
CO₂ Laser Cutting Machine 40W-600W Positioning Accuracy±0.05mm
video
Semiconductor Equipment

CO₂ Laser Cutting Machine 40W-600W Positioning Accuracy±0.05mm
Model：CO₂ Laser Cutting Machine
MOQ：5
Contact Now
Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups
video
Semiconductor Equipment

Bionic Non-slip Pad High Friction Low Adhesion Wafers Carry Bionic Friction Pad Suction Cups
Model：Bionic non-slip pad
Price：by case
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Microfluidic Laser Equipment For Semiconductor Wafer Processing
video
Semiconductor Equipment

Microfluidic Laser Equipment For Semiconductor Wafer Processing
Model：Microfluidic laser equipment
MOQ：1
Contact Now
Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material
video
Semiconductor Equipment

Microjet Laser Technology Equipment Wafer Slice Metal Silicon Carbide Material
Model：Microjet laser technology equipment
MOQ：1
Contact Now
​​END PUMP LASER MARKING MACHINE 8W-40W Laser Wave Length 1064nm
video
Semiconductor Equipment

​​END PUMP LASER MARKING MACHINE 8W-40W Laser Wave Length 1064nm
Model：​​END PUMP LASER MARKING MACHINE
MOQ：5
Contact Now
Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
video
Semiconductor Equipment

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 Inch
Model：Wafer Bonding Equipment
MOQ：2
Contact Now
Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity
video
Semiconductor Equipment

Wafer Thinning System Precision Thinning Equipment SiC Si Wafer Compatible 4 -12inch Wafer Capacity
Model：Wafer Precision Thinning Equipment
MOQ：2
Contact Now
Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing
video
Semiconductor Equipment

Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing
Model：Diamond Wire Single/Multiple Wire Saw machine
MOQ：3
Contact Now
Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine
video
Semiconductor Equipment

Diamond Wire / Multi-Wire / High-Speed / High-Precision / Descending / Oscillating Cutting Machine
Model：Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
MOQ：3
Contact Now
Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing
video
Semiconductor Equipment

Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC / Sapphire / Silicon Processing
Model：Diamond Wire Triple-Station Single-Wire Cutting Machine
MOQ：3
Contact Now
​​Diamond Wire Single / Multi-Wire Dual-Station Cutting Machine For Sapphire / SiC Material Processing​​
video
Semiconductor Equipment

​​Diamond Wire Single / Multi-Wire Dual-Station Cutting Machine For Sapphire / SiC Material Processing​​
Model：Diamond Wire Single/Multiple Wire Saw machine
MOQ：3
Contact Now
Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
video
Semiconductor Equipment

Diamond Wire Multi-Wire High-Speed High-Precision Processing Hard Brittle Materials​​ Semiconductor Equipment
Model：Diamond Wire/Multi-Wire/High-Speed/High-Precision/Descending/Oscillating Cutting Machine
MOQ：3
Contact Now
​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
video
Semiconductor Equipment

​​Diamond Wire Triple-Station Single-Wire Cutting Machine for Sapphire Ceramics​​
Model：Diamond Wire Triple-Station Single-Wire Cutting Machine
MOQ：3
Contact Now
Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
video
Semiconductor Equipment

Fully Automatic Precision Dicing Saw Equipment For 8inch 12inch Wafer Cutting
Model：Fully Automatic Precision Dicing Saw equipment
MOQ：2
Contact Now
​​20W-200W Fiber Laser Marking Machine for Metal and Non-metal Laser Engraving​​
video
Semiconductor Equipment

​​20W-200W Fiber Laser Marking Machine for Metal and Non-metal Laser Engraving​​
Model：Fiber Laser Marking Machine
MOQ：5
Contact Now
​​XRD-Based Wafer Orientation Instrument for High-Precision Cutting Angle Determination​​
Semiconductor Equipment

​​XRD-Based Wafer Orientation Instrument for High-Precision Cutting Angle Determination​​
Model：Wafer Orientation Instrument
MOQ：3
Contact Now
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