RT/duroid® 6202 Copper Clad Laminate: Engineered for Exceptional Electrical and Mechanical Stability

RT/duroid® 6202 is a high-performance, ceramic-filled PTFE composite laminate designed to deliver outstanding electrical stability and robust mechanical properties for demanding microwave and RF applications. It builds upon the legacy of the RT/duroid 6000 series, offering designers a material with a tightly controlled, low dielectric constant, minimal signal loss, and exceptional thermal reliability—making it a premier choice for complex, high-frequency circuits that must perform consistently in challenging environments.

A hallmark of the RT/duroid 6202 is its exceptionally low and stable thermal coefficient of dielectric constant (+5 ppm/°C from -50°C to +150°C at 10 GHz). This outstanding thermal stability ensures that critical electrical parameters such as phase and frequency in filters, oscillators, and delay lines remain predictable over wide temperature swings, a crucial requirement for aerospace, defense, and telecommunications systems. Coupled with a low dissipation factor (0.0015 @ 10 GHz), the material enables high-efficiency, low-loss circuit designs.

The laminate is engineered for superior dimensional stability (0.07 mm/m) and features a balanced coefficient of thermal expansion (15 ppm/°C in X/Y, 30 ppm/°C in Z), which minimizes stress on plated through-holes and solder joints during thermal cycling. This, combined with a high thermal conductivity (0.68 W/m/K) for effective heat dissipation and excellent copper adhesion, ensures long-term reliability in multilayer and surface-mount assemblies. The material is fully compatible with lead-free assembly processes and carries a UL 94 V-0 flammability rating.

Data sheet

Standard Specifications of RT/duroid® 6202 Laminate:

Electrical Properties (@ 10 GHz, 23°C):

Dielectric Constant (Dk):

Standard (≥0.020"): 2.94 ±0.04

0.010"/0.015": 3.02 ±0.04

0.005": 3.06 ±0.04

Dissipation Factor (Df): 0.0015

Thermal Coefficient of Dk (TCDk): +5 ppm/°C (-50°C to +150°C)

Volume Resistivity: 10⁶ MΩ·cm

Surface Resistivity: 10⁹ MΩ

Thermal & Physical Properties:

Coefficient of Thermal Expansion (CTE): X & Y-axis: 15 ppm/°C, Z-axis: 30 ppm/°C

Decomposition Temperature (Td): 500°C

Thermal Conductivity: 0.68 W/(m·K)

Moisture Absorption: 0.04%

Density: 2.1 g/cm³

Mechanical Properties:

Copper Peel Strength: 1.6 N/mm (9.1 lbs/in)

Dimensional Stability: 0.07 mm/m (X, Y)

Tensile Modulus (X, Y): 1007 MPa (146 kpsi)

Compressive Modulus (Z): 1035 MPa (150 kpsi)

Flammability: UL 94 V-0

Lead-Free Process Compatible: Yes

Common Thicknesses & Tolerances:

0.005" (0.127 mm) ±0.0005"

0.020" (0.508 mm) ±0.0010"

0.030" (0.762 mm) ±0.0010"

Extended Range: Available from 0.005" to 0.060" in varying increments.

Standard Panel Sizes: 12" × 18" (305 × 457 mm) and 24" × 18" (610 × 457 mm).

Electrodeposited Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Rolled Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Specialty Options: Reverse treated ED foil and resistive foil claddings are also available.

RT/duroid 6202 is ideally suited for applications requiring unwavering electrical stability and mechanical integrity, such as complex multilayer circuits, precision filters, low-noise amplifiers, and antennas for hostile environments. Its combination of low loss, excellent thermal management, and proven reliability makes it a trusted substrate for mission-critical high-frequency designs across aerospace, defense, and advanced commercial markets.