RT/duroid® 6002 Copper Clad Laminate: The Standard for High-Reliability Microwave Designs

RT/duroid® 6002 is a pioneering low-loss, low-dielectric constant microwave laminate that has set the benchmark for electrical stability and mechanical reliability in complex high-frequency circuits. As one of the first materials of its kind, it continues to be a preferred choice for engineers designing demanding microwave structures where consistent electrical performance and robust physical properties are non-negotiable. Its unique formulation provides an exceptional balance that supports both intricate electrical functionality and long-term durability in hostile environments.

A cornerstone of RT/duroid 6002's performance is its extremely low thermal coefficient of dielectric constant (+12 ppm/°C from 0-100°C at 10 GHz). This translates to outstanding electrical stability across a wide temperature range (-55°C to +150°C), making it ideal for thermally sensitive components such as filters, oscillators, and delay lines. Furthermore, its low Z-axis coefficient of thermal expansion (24 ppm/°C) ensures exceptional plated through-hole (PTH) reliability, proven by withstanding over 5000 temperature cycles without failure.

The material is engineered for superior dimensional stability (0.2 to 0.5 mils/inch) by matching its X and Y-axis CTE (16 ppm/°C) to that of copper. This minimizes etching-related registration issues and reduces stress on solder joints, significantly enhancing the reliability of surface-mount assemblies. RT/duroid 6002 is inherently compatible with lead-free assembly processes and carries a UL 94 V-0 flammability rating, meeting stringent safety and environmental standards.

Data Sheet

Standard Specifications of RT/duroid® 6002 Laminate:

Electrical Properties (@ 10 GHz, 23°C):

Dielectric Constant (Dk): 2.94 ±0.04 (Process & Design)

Dissipation Factor (Df): 0.0012

Thermal Coefficient of Dk: +12 ppm/°C (0-100°C @ 10 GHz)

Volume Resistivity: 10⁶ MΩ·cm

Surface Resistivity: 10⁷ MΩ

Thermal & Physical Properties:

Coefficient of Thermal Expansion (CTE): X & Y-axis: 16 ppm/°C, Z-axis: 24 ppm/°C

Decomposition Temperature (Td): 500°C

Thermal Conductivity: 0.60 W/(m·K)

Moisture Absorption: 0.02%

Density: 2.1 g/cm³

Mechanical Properties:

Copper Peel Strength: 1.6 N/mm (8.9 lbs/in)

Tensile Modulus (X, Y): 828 MPa (120 kpsi)

Compressive Modulus (Z): 2482 MPa (360 kpsi)

Dimensional Stability: 0.2 - 0.5 mils/inch

Common Thicknesses & Tolerances:

• 0.010" (0.252 mm) ±0.0007"
• 0.020" (0.508 mm) ±0.0010"
• 0.030" (0.762 mm) ±0.0010"
• 0.060" (1.524 mm) ±0.0020"

Extended Range: Available from 0.005" to 0.250" in 0.005" increments.

Standard Panel Sizes: 18" × 12" (457 × 305 mm) and 18" × 24" (457 × 610 mm).

Standard Copper Claddings:

Electrodeposited Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Rolled Copper Foil: ½ oz (18 µm) and 1 oz (35 µm).

Specialty Options: Also available clad with aluminum, brass, copper plates, and resistive foils.

RT/duroid 6002 is exceptionally well-suited for complex multi-layer circuits, aerospace systems, antennas (both planar and non-planar), and any application requiring unwavering performance under thermal and mechanical stress. Its proven history, combined with outstanding electrical stability and via reliability, solidifies its position as a foundational material for mission-critical, high-frequency designs.