DiClad® 870 Copper-Clad Laminate: The Benchmark for Low-Loss, High-Frequency Circuitry

We are proud to present the DiClad® 870, a premier woven fiberglass/PTFE laminate from Rogers Corporation, renowned for its exceptional electrical performance and reliability in demanding RF and microwave applications. Engineered with precise control of the fiberglass-to-PTFE ratio, DiClad 870 is specifically designed to provide an optimal balance of low dielectric constant, ultra-low loss, and the superior dimensional stability that only woven reinforcement can offer. This makes it an ideal substrate for applications where signal integrity, consistency, and performance predictability are non-negotiable.

Superior Dimensional Stability and Uniformity
The core advantage of DiClad 870 lies in its precision-woven fiberglass reinforcement within a PTFE matrix. Unlike non-woven composites, this controlled, cloth-based structure delivers far greater dimensional stability, minimizing panel movement during thermal cycles and multilayer lamination. This translates directly into higher manufacturing yields, improved layer-to-layer registration, and predictable final board geometries—critical for complex, high-frequency designs. The uniform construction also ensures excellent dielectric constant (Dk) uniformity across the panel, a feature vital for the consistent performance of sensitive components like filters, couplers, and low-noise amplifiers (LNAs).

Low-Loss Electrical Performance

Low Dielectric Constant: A stable Dk of 2.33 (at both 1 MHz and 10 GHz), enabling precise impedance control and favorable signal propagation speeds.

Ultra-Low Dissipation Factor: An impressively low Df of 0.0013 at 10 GHz (and 0.0009 at 1 MHz). This ultra-low loss tangent ensures minimal signal attenuation, extending the usefulness of DiClad 870 to Ku-band and beyond, making it perfect for high-performance, low-noise systems.

Thermal Stability: Exhibits a low thermal coefficient of Dk (-161 ppm/°C), ensuring stable electrical behavior across a wide operational temperature range.

DiClad 870 features:

Excellent Mechanical Strength: High tensile, compressive, and flexural modulus values support robust assemblies and withstand rigorous PCB fabrication processes.

Reliable Copper Bond: Strong peel strength of 14 lbs/in ensures secure plated through-holes and component attachment.

Environmental Resilience: Exhibits very low moisture absorption (0.02%), meets NASA outgassing requirements, and carries a UL 94 V-0 flammability rating, making it suitable for aerospace, defense, and other high-reliability applications.

Standard Specifications for DiClad 870:

Dielectric Constant (Dk): 2.33 (at 10 GHz and 1 MHz)

Dissipation Factor (Df): 0.0013 @ 10 GHz; 0.0009 @ 1 MHz

Standard Thicknesses & Tolerances:

• 0.031" (0.79mm) ±0.0020"
• 0.093" (2.36mm) ±0.0030"
• 0.125" (3.18mm) ±0.0060"

Standard Panel Sizes:

• 8" x 12" (203 x 305mm)
• 18" x 24" (457 x 610mm)

Standard Cladding Options:

• Electrodeposited Copper Foil: ½ oz (18µm) and 1 oz (35µm)
• Rolled Copper Foil: ½ oz (18µm) and 1 oz (35µm) – ideal for applications requiring the lowest possible conductor loss at extremely high frequencies.

Key Property Benchmarks:

• Volume Resistivity: 1.5 x 10⁹ MΩ·cm
• Surface Resistivity: 3.4 x 10⁷ MΩ
• CTE (X/Y/Z): Approximately 17 / 29 / 217 ppm/°C
• Thermal Conductivity: 0.26 W/(m·K)
• Density: 2.26 g/cm³

Ideal Application Areas

• DiClad 870 is the substrate of choice for:
• High-Frequency Filters, Couplers, and Hybrids
• Low-Noise Amplifiers (LNAs) and Power Dividers/Combiners
• Aerospace and Defense Radar/Electronic Warfare Systems
• Satellite Communication Payloads

In summary, DiClad 870 delivers a proven, high-performance foundation that bridges the gap between ultra-low electrical loss and the mechanical reliability required for advanced RF manufacturing.

Contact our sales team today to discuss your specific project requirements, confirm availability, or request technical data and samples.