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Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering
Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering
Specifications
Brand Name :
Yiding
Certification :
ISO 9001
Place of Origin :
Guangdong, China
Material Specification :
Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); optional nickel or gold plating.
Dimensional Tolerances :
Critical Features – ±0.005 mm (device alignment); Overall Body – ±0.02 mm
Flatness/Coplanarity :
≤0.01 mm across seating surface (ensures uniform contact pressure).
Pin/Lead Channel Width & Depth :
Width – ±0.003 mm; Depth – ±0.005 mm (adjustable for lead deflection).
Pin/Lead Channel Pitch Accuracy :
±0.005 mm (fine-pitch ICs), ±0.01 mm (standard).
Description
Semiconductor Test Socket Guide
Product Overview
The Semiconductor Test Socket Guide is engineered to deliver consistent performance across thousands of test insertions. By controlling vertical axis movement, it prevents off-axis actuation that can cause uneven contact force or premature probe wear. Precision-machined guide holes with chamfered lead-ins and optimized clearance profiles ensure smooth compression of pogo pins. The result is repeatable contact resistance, extended socket life, and superior reliability in high-throughput ATE environments.
Surface & Finish
  • Contact Channels: Ra ≤ 0.2 µm (mirror finish)
  • Non-Contact Surfaces: Ra ≤ 0.8 µm
  • Burr-Free: Micro-deburred edges, ISO 13715 compliant
Protective Coatings & Plating Options
  • Hard-coat anodizing (Aluminum)
  • Electroless Nickel (50-100 µin)
  • Gold Flash (0.1-0.3 µin) for enhanced conductivity
Cleanliness & Packaging
  • Class 100 cleanroom packaging
  • Non-volatile residue <5 µg/cm²
  • Ion-free option available
Certifications
ISO 9001:2015 | IPC-9592 (High-Reliability) | MIL-STD-883
Technical Advantages
  • Built from CTE-matched polymers or ceramic-filled compounds for resistance to thermal distortion
  • Maintains dimensional stability at temperatures >150 °C during HTOL and burn-in procedures
  • Prevents warping, misalignment, or probe disengagement under thermal cycling
  • Designed for >100,000 insertions with high-hardness composites and abrasion-resistant materials
  • PTFE fillers or dry-film coatings reduce friction, galling, and particle generation
With its precision engineering, the Semiconductor Test Socket Guide ensures dimensional integrity, long-term durability, and reliable test results — even under demanding mechanical and thermal conditions.
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Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering

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Product Detail
Brand Name :
Yiding
Certification :
ISO 9001
Place of Origin :
Guangdong, China
Material Specification :
Stainless Steel 17-4PH (standard), Beryllium Copper (high-cycle), Titanium (lightweight); optional nickel or gold plating.
Dimensional Tolerances :
Critical Features – ±0.005 mm (device alignment); Overall Body – ±0.02 mm
Flatness/Coplanarity :
≤0.01 mm across seating surface (ensures uniform contact pressure).
Contact Supplier
Burr Free Semiconductor Test Sockets With Tight Tolerance Precision Engineering

Dongguan Yiding Technologies Co., Ltd.

Verified Supplier
1 Years
dongguan
Business Type :
Manufacturer, Exporter, Seller
Main Products :
CNC Machining Service, CNC Turning Service, Sheet Metal Fabrication
Total Annual :
1500000-2000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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