Specifications
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
OSP
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.2 mm (Customizable)
Place of Origin :
China
Copper Thickness :
0.5 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
1-Layer
Description

Single Layer Printed Circuit Board with White Solder Mask 0.2mm FR-4 PCB Board with OSP for Display Backlight

This single-layer FR-4 PCB features 0.2mm finished thickness, white solder mask and OSP surface finish, specially manufactured for display backlight driver assemblies. The lightweight thin FR4 substrate meets the ultra-thin structural requirements of backlight modules. White solder mask offers high reflectivity to improve light utilization efficiency of LED backlights. OSP treatment provides good solderability for LED chips and passive components with cost-effective advantages. Stable insulation performance and reliable circuit etching ensure consistent current transmission for backlight circuits. Widely used in LCD screens, tablet displays, monitor backlight strips, notebook panel backlight modules and small-size display lighting units.

Key Specifications
Layer Count 1-Layer
Material FR-4
Board Thickness 0.2 mm (Customizable)
Copper Thickness 0.5 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color White
Surface Finish OSP

Product Description

  • Single layer PCB construction, finished board thickness: 0.2mm, ultra-thin and lightweight
  • FR-4 base material, excellent electrical insulation and good dimensional stability
  • White solder mask, high light reflectivity, enhance LED backlight luminous efficiency
  • OSP organic solderability preservative surface treatment, economical and eco-friendly
  • Precise circuit etching, uniform trace width for stable LED current output
  • Flexible ultra-thin board design, suitable for narrow space backlight module assembly
  • Good heat dissipation performance for low-power LED backlight circuits
  • Low water absorption, stable performance in normal display working temperature
  • Support customized circuit pattern, panel size and routing according to drawings
  • Cost-effective solution for mass production of display backlight units
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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OSP Single Layer Printed Circuit Board FR-4 White Solder Mask PCB For Display Backlight

Ask Latest Price
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
OSP
Payment Terms :
Western Union
Contact Supplier
OSP Single Layer Printed Circuit Board FR-4 White Solder Mask PCB For Display Backlight

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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