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Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication
Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication
Specifications
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free tin spraying
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.5 mm (Customizable)
Place of Origin :
China
Copper Thickness :
0.5 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
1-Layer
Description

Lead-free Tin Spraying Fast Prototype PCB Fabrication Single Layer

The Lead-Free Tin Spraying Fast Prototype Single Layer PCB is a cost-effective and reliable solution for rapid product development, electronic testing, and low-complexity circuit applications. Manufactured using environmentally friendly lead-free HASL (Hot Air Solder Leveling) surface treatment, this PCB provides excellent solderability, oxidation resistance, and compliance with RoHS environmental standards.

Key Specifications
Layer Count 1-Layer
Material FR-4
Board Thickness 0.5 mm (Customizable)
Copper Thickness 0.5 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish Lead-free tin spraying

Product Description

  • Fast Prototype Manufacturing
    • Short production cycles accelerate product development and testing.
    • Ideal for proof-of-concept, engineering validation, and functional prototypes.
  • Lead-Free HASL Surface Finish
    • Environmentally friendly process compliant with RoHS requirements.
    • Provides excellent solderability and strong solder joint reliability.
  • Single-Layer PCB Design
    • Cost-effective solution for simple circuit applications.
    • Easy to manufacture and assemble.
  • Excellent Solderability
    • Uniform tin coating enhances component mounting performance.
    • Compatible with manual soldering and automated assembly processes.
  • Reliable Electrical Performance
    • Stable circuit conductivity and insulation characteristics.
    • Suitable for low- to medium-complexity electronic designs.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication

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Product Detail
Model Number :
XSWPCB
Material :
FR-4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
Lead-free tin spraying
Payment Terms :
Western Union
Contact Supplier
Lead Free Tin Spraying Single Layer Printed Circuit Board Fast Prototype PCB Fabrication

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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