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2 Layer Radio Frequency PCB On Rogers 30 Mil (0.762mm) RO4350B For I/O Amplifier
2 Layer Radio Frequency PCB On Rogers 30 Mil (0.762mm) RO4350B For I/O Amplifier
Specifications
Model Number :
XSWPCB
Material :
Rogers
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
0.8 mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
2-Layer
Description

Radio Frequency PCB On Rogers 30 mil(0.762mm) RO4350B With Immersion Gold for I/O Amplifier

RF PCB On 30 mil(0.762mm) RO4350B With Immersion Gold(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference) General descriptionThis is a type of RF PCB built on 30mil RO4350B substrate with Tg 280°C for the application of Wireless Communication. It's 0.80 mm thick with 2 layers copper, white silkscreen over green solder mask and immersion gold are on pads.

Key Specifications
Layer Count 2-Layer
Material Rogers
Board Thickness 0.8 mm (Customizable)
Copper Thickness 1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • Optimized for RF I/O Amplifier Applications
    • Designed for RF input/output amplifiers, power amplifiers, low-noise amplifiers (LNA), RF front-end modules, and wireless communication equipment.
    • Suitable for 5G infrastructure, satellite communication, radar systems, and RF test instruments.
  • Excellent High-Frequency Signal Integrity
    • Low-loss substrate minimizes insertion loss and signal attenuation.
    • Controlled impedance routing improves transmission accuracy and reduces signal reflection.
  • Immersion Gold (ENIG) Surface Finish
    • Provides outstanding solderability and flat pad surfaces for fine-pitch SMT components.
    • Offers excellent corrosion resistance and reliable electrical contact for RF applications.
  • Superior Thermal Stability
    • High thermal stability with Tg above 280°C supports lead-free soldering and continuous high-power operation.
    • Low Z-axis coefficient of thermal expansion improves plated through-hole reliability during thermal cycling.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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2 Layer Radio Frequency PCB On Rogers 30 Mil (0.762mm) RO4350B For I/O Amplifier

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Product Detail
Model Number :
XSWPCB
Material :
Rogers
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
2 Layer Radio Frequency PCB On Rogers 30 Mil (0.762mm) RO4350B For I/O Amplifier

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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