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Immersion Gold PCB Multilayer Microwave RF Communication PCB Board
Immersion Gold PCB Multilayer Microwave RF Communication PCB Board
Specifications
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Board Thickness :
1.2 mm (Customizable)
Place of Origin :
China
Copper Thickness :
1/1/1/1 oz
Price :
Negotiable
Brand Name :
XSW PCB
Layer Count :
4-Layer
Description

Immersion Gold PCB Multilayer PCB Circuit Microwave Radio Frequency Communication Board

The Immersion Gold Multilayer PCB Circuit Board is specifically designed for microwave, radio frequency (RF), and high-speed communication applications. Manufactured using advanced multilayer PCB technology and premium high-frequency materials, this board delivers excellent signal integrity, low transmission loss, and superior electromagnetic compatibility for demanding wireless communication systems.

Key Specifications
Layer Count 4-Layer
Material FR4
Board Thickness 1.2 mm (Customizable)
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.1 mm
Minimum Line Width 0.1 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG

Product Description

  • Optimized for Microwave & RF Applications
    • Designed for high-frequency signal transmission and microwave communication systems.
    • Suitable for RF circuits operating in demanding communication environments.
  • Multilayer PCB Construction
    • Supports complex signal routing and high-density circuit layouts.
    • Dedicated power and ground planes improve signal stability and EMI suppression.
  • ENIG (Immersion Gold) Surface Finish
    • Provides excellent solderability and flat surface characteristics.
    • Enhances corrosion resistance and long-term electrical reliability.
  • Excellent Signal Integrity
    • Controlled impedance design minimizes signal reflection and transmission loss.
    • Supports high-speed and high-frequency communication protocols.
  • Low Insertion Loss
    • High-frequency material options reduce attenuation in RF and microwave circuits.
    • Improves overall communication efficiency.
  • Design Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

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Product Detail
Model Number :
XSWPCB
Material :
FR4
MOQ :
1
Delivery Time :
8-15DAYS
Surface Finish :
ENIG
Payment Terms :
Western Union
Contact Supplier
Immersion Gold PCB Multilayer Microwave RF Communication PCB Board

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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