SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
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2 Years
shenzhen
Since 2009
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Bonding Wire
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Bonding Wire

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Gold Plated Tungsten Wire

 (41)

Gold Plated Copper Wire

 (20)

Gold Plated Molybdenum Wire

 (21)

Tungsten Wire

 (17)

Gold Plated Silver Wire

 (21)

Palladium Coated Copper Wire

 (26)

Ultra Fine Copper Wire

 (8)

Beryllium Copper Wire

 (18)

Spring Test Probes

 (9)

Gold Electroplating Service

 (2)

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Quality Control

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.

Certification

SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Certifications
Standard: ISO9001
Number: CNQMS047967
Issue Date: 2021-06-21
Expiry Date: 2024-06-21
Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By: NSFInternational Strategic Registrations
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Certifications
Standard: IATF 16949:2016
Number: 0406197
Issue Date: 2021-06-21
Expiry Date: 2024-06-21
Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By: NSFInternational Strategic Registrations
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Certifications
Standard: GB/T24001-2016/IS014001:2015
Number: 2052022E00126R2M
Issue Date: 2022-07-25
Expiry Date: 2026-07-24
Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By: IAF and CNAS
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Certifications
Standard: Integration of Informatizafion and Industrialization Management System Certificate
Number: AIITRE-00123IIIMS0470801
Issue Date: 2023-05-26
Expiry Date: 2026-05-25
Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By: CEPREI
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD. Certifications
Standard: GJB 9001C-2017
Number: 02623J31381R0M
Issue Date: 2023-06-27
Expiry Date: 2026-06-26
Scope/Range: Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Issued By: BTCC-GJB
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