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Direct gun electron beam coating machine with PLC system pvd coating equipment
Direct gun electron beam coating machine with PLC system pvd coating equipment
Specifications
Brand Name :
Zhongda
Certification :
CE
Place of Origin :
Zhaoqing, Guangdong
MOQ :
1
Delivery Time :
45-60 work days
Evaporation Source :
2 Sets
Powersupply :
AC 220V/380V, 50/60Hz
Rotation System :
2 Sets
Coating Power Supply :
DC/RF/AC
Pumptype :
Rotary vane pump + diffusion pump
Chambermaterial :
Stainless steel
Coating Efficiency :
High
Coating Speed :
1-4m/min
Coating Chamber Size :
Customized
Coating Method :
Evaporation
Coating Technology :
Vacuum Thermal Evaporation
Chamber Material :
Stainless Steel Or Carbon Steel
Coating Transparency :
High
Cooling Method :
Water Cooling
China Coating Deposition Rate :
Adjustable
Operation Mode :
Manual/Automatic
Description
I. Core Structure
Vacuum system
  • Core components: Vacuum chamber, molecular pump, mechanical pump, vacuum gauge (ionization type/resistance type).
  • Function: It provides a high vacuum environment of 10⁻³ to 10⁻⁶ Pa, reducing electron beam scattering, target material oxidation and film contamination, and ensuring the stability of the evaporation and deposition process.
Straight gun electron gun (core actuating component) :
  • Composition: Direct heating cathode (usually tungsten wire, tantalum wire or LaB₆ crystal), anode, focusing coil, deflection coil.
  • Features: The cathode is directly electrified to heat and emit electrons. The electron beam is accelerated by the anode (the acceleration voltage is usually 10 to 30kV), focused by the focusing coil, and then deflected along a straight line or at a small Angle to bombard the surface of the target material.
Target material system
  • Including: water-cooled crucibles (made of copper or molybdenum to prevent deformation of the crucible after the target material melts), target material supports, and multi-target position switching devices (supporting continuous deposition of multiple materials).
  • Compatible target materials: metals (aluminum, titanium, gold, silver), alloys (TiAl, NiCr), oxides (SiO₂, TiO₂), fluorides (MgF₂), and other solid materials.
Workpiece rack and heating/cooling system:
  • Workpiece rack: Rotatable (to enhance the uniformity of the film), supporting the fixation of workpieces of different shapes such as glass, silicon wafers, and metal substrates;
  • Temperature control module: According to process requirements, it can heat the workpiece (100~500℃ to enhance the adhesion of the film) or cool it (to prevent deformation of heat-sensitive substrates).
Control system
  • Core: PLC controller, touch screen operation interface, which can precisely adjust the electron beam current (0~100mA), acceleration voltage, vacuum degree, deposition rate, and film thickness (monitored in real time through quartz crystal oscillation method).
  • Protection functions: Equipped with safety mechanisms such as insufficient vacuum alarm, overcurrent protection, and cathodic overload protection.
Auxiliary system
  • Inflation system (argon, oxygen and other reaction gases can be introduced to prepare compound films), ion source (optional, used for film pre-cleaning or ion-assisted deposition to enhance the density of the film layer).
Ii. Working Principle
  1. Vacuum preparation: Start the mechanical pump and molecular pump, evacuate the vacuum chamber to the preset high vacuum degree (usually ≤10⁻⁴ Pa), and eliminate the influence of impurities such as air and water vapor on the coating.
  2. Electron beam generation and acceleration: After being electrified, the direct-heating cathode is heated to a high temperature (about 2500℃ for tungsten filament cathodes), releasing hot electrons. High voltage (10 to 30kV) is applied to the anode to form a strong electric field that accelerates electrons, enabling them to gain high energy (kinetic energy E=eU, where e is the charge of the electron and U is the acceleration voltage).
  3. Electron beam focusing and deflection: The focusing coil generates a magnetic field, converging the divergent electron beam into a fine beam (with a diameter as small as the micrometer level), and the deflection coil can fine-tune the direction of the electron beam to ensure precise bombardment of the central area of the target material.
  4. Target material evaporation: A high-energy electron beam bombards the surface of the target material, converting kinetic energy into thermal energy, causing the local temperature of the target material to rapidly rise above the melting point (metal targets typically require 1000 to 3000 degrees Celsius), resulting in melting and evaporation, and forming a high-density target material atomic/molecular gas phase.
  5. Thin film deposition: The gas phase of the target material diffuses in all directions in a vacuum environment and is eventually uniformly deposited on the surface of the pre-treated workpiece. The deposition rate is monitored in real time by a quartz crystal oscillator. When the preset thickness is reached, the electron beam bombardment is stopped to complete the coating.
  6. Optional process expansion: If compound films (such as TiO₂, SiO₂) need to be prepared, an appropriate amount of reaction gas (such as oxygen) can be introduced during the deposition process to enable the target material atoms and gas molecules to undergo chemical reactions on the workpiece surface, forming functionalized films.
Iii. Core Features
  • The energy of the electron beam is concentrated and the target material utilization rate is high: The straight gun structure enables the electron beam to directly bombard the surface of the target material, with low energy loss. The heat is concentrated in a local area of the target material, avoiding large-scale heating of the crucible. The target material utilization rate can reach 60% to 80% (much higher than the 30% to 50% of resistance evaporation coating machines).
  • The controllable range of deposition rate is wide: By adjusting the electron beam current and acceleration voltage, a deposition rate of 0.1nm/s to 10nm/s can be achieved, which can not only prepare ultra-thin films (such as nanoscale optical films), but also rapidly deposit thick films (such as metal conductive films).
  • Compatible with a variety of high-melting-point target materials: Electron beam bombardment can generate extremely high local temperatures (up to over 5000℃), capable of evaporating high-melting-point metals such as tungsten, molybdenum, and tantalum (melting point > 2000℃), as well as refractory compounds like oxides and fluorides, which is difficult to achieve through resistance evaporation.
  • High film purity and low contamination: The high vacuum environment reduces the mixing of impurities, and the straight gun electron gun has no crucible contamination (some low-melting-point target materials still require crucibles, but inert materials can be selected). The film purity can usually reach 99.9% to 99.99%.
  • Strong process flexibility: Supports single-target deposition, multi-target continuous deposition (for preparing multilayer films), and reactive deposition (for preparing compound films). Film performance can be customized by adjusting parameters such as temperature, vacuum degree, and gas flow rate.
  • The equipment structure is relatively simple and the maintenance cost is moderate: Compared with magnetron sputtering and RF coating machines, the direct gun electron beam coating machine has fewer core components, a lower operation threshold, and the replacement of vulnerable parts such as the cathode (tungsten wire) is convenient. The long-term maintenance cost is controllable.
Iv. Main Advantages
  • The film quality is excellent: The deposited film has high density, fine grains, strong adhesion to the substrate (especially suitable for metal and glass substrates), and good thickness uniformity (uniformity error for large-area workpieces ≤±5%).
  • High deposition efficiency and short production cycle: The electron beam has a high energy conversion efficiency (about 30% to 50%), and the evaporation speed of the target material is fast. The deposition time of films of the same thickness is only 1/3 to 1/2 of that of resistance evaporation, making it suitable for mass production.
  • The target material adaptability is extremely wide: from low-melting-point metals (aluminum, copper), high-melting-point metals (tungsten, molybdenum), to alloys, oxides, fluorides, sulfides, etc., almost all solid coating materials can be adapted to meet different functional requirements.
  • The performance of the film can be precisely regulated: By adjusting the parameters of the electron beam, deposition rate, workpiece temperature, etc., the key indicators of the film such as crystallinity, hardness, adhesion, and optical properties (such as refractive index, light transmittance) can be precisely controlled.
  • Environmentally friendly and pollution-free: No chemical waste liquid or waste gas is produced throughout the process. Only electricity and target materials are consumed, meeting the requirements of green manufacturing.
  • It has a wide range of applicable substrates: It can be coated on the surfaces of various substrates such as glass, silicon wafers, metals, ceramics, and plastics (pre-treatment is required), and causes little damage to the substrates (the electron beam does not directly contact the substrate, and the heat-affected zone is small).
V. Typical Application Scenarios
Optical field (Core applications) :
  • Preparation of optical films: such as AR anti-reflection films for spectacle lenses and camera lenses (SiO₂+TiO₂ multilayer films), HR high-reflection films for laser lenses (multilayer dielectric films), and interference filter films for filters (narrowband/broadband filters);
  • Other optical components: optical fibers, display panels, and anti-reflective/scratch-resistant films for solar cell covers.
In the field of electronics and semiconductors
  • Semiconductor chips: Preparation of conductive films for metals such as aluminum and copper, and barrier films of titanium and tungsten;
  • Electronic components: capacitor electrode films, magnetic recording medium films, sensor sensitive films (such as tin oxide gas-sensitive films);
  • Display technology: Transparent conductive films for OLED panels (ITO alternative materials, such as AZO), and the bottom layer of polarizing films for liquid crystal displays.
Decoration and protection field:
  • High-end decoration: Imitation gold (TiN), rose gold (TiAlN), and black (CrN) decorative films for watch case straps, jewelry, and bathroom hardware.
  • Protective coatings: Wear-resistant coatings for cutting tools and molds (TiN, TiCN), anti-corrosion coatings for metal parts (aluminum film, chromium film).
Aerospace
  • Aviation components: Anti-fog/anti-ice films for aircraft windshields, high-temperature protective films for engine blades;
Other fields
  • Medical field: Biocompatible films (such as titanium films, titanium nitride films) for medical devices (such as surgical instruments, implants);
  • In the field of new energy: conductive films (copper films, aluminum films) for lithium battery tabs, backreflective films (aluminum films, silver films) for solar cells;
  • Packaging field: Vacuum aluminum-coated film for food packaging (high barrier property, preservation property).
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Direct gun electron beam coating machine with PLC system pvd coating equipment

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Product Detail
Brand Name :
Zhongda
Certification :
CE
Place of Origin :
Zhaoqing, Guangdong
MOQ :
1
Delivery Time :
45-60 work days
Evaporation Source :
2 Sets
Contact Supplier
Direct gun electron beam coating machine with PLC system pvd coating equipment

Guangdong Zhongda Vacuum Equipment Co., Ltd.

Verified Supplier
2 Years
guangdong, zhaoqing
Since 2003
Business Type :
Manufacturer
Main Products :
Evaporation Vacuum Coating Machine, Magnetron Sputtering Vacuum Coating Machine, Multi Arc Ion Vacuum Coating Machine
Total Annual :
1 million US dollars-2 million US dollars
Employee Number :
80people~100 people
Certification Level :
Verified Supplier
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