Product Introduction: Semiconductor Silicon Wafer Cleaner
A precision-engineered solution for semiconductor manufacturing, this ultrasonic cleaning system integrates multi-stage processes to achieve sub-micron level surface purity on silicon wafers—critical for maintaining device performance in advanced node fabrication (down to 5nm).
Sequential Cleaning Stages:
- Ultrasonic Alkaline Scrubbing: Employs 40KHz-80KHz ultrasonic cavitation in alkaline bath to decompose organic contaminants, strip photoresist residuals, and dislodge macro-particles (≥1μm) from wafer surfaces and via structures. The frequency-tunable ultrasonic energy ensures uniform cleaning across 4"-12" wafer diameters, including edge exclusion zones.
- Ultrasonic Acid Etching: Utilizes the same frequency range in acidic media to dissolve inorganic impurities—specifically metal ions (Fe, Cu, Zn) and native oxide layers (SiO₂). Cavitation micro-jets penetrate patterned features to remove embedded sub-100nm contaminants, validated by particle counter readings (≤10 particles/wafer for ≥0.1μm).
- UPW Rinsing: Final rinse with ultra-pure water (UPW, TOC ≤5ppb) flushes residual chemistries, achieving surface resistivity ≥18.2MΩ·cm—meeting SEMI F20 standards for pre-deposition cleaning.
Process Parameters:
- Frequency Band: 40KHz-80KHz (multi-frequency operation, selectable via HMI for contamination-specific tuning)
- Temperature Setpoint: 60℃ (PID-controlled, ±1℃ tolerance) to optimize chemical reaction kinetics without inducing wafer warpage.
- Material Compatibility: Wetted components in PFA (perfluoroalkoxy) and sapphire to prevent metallic ion leaching, ensuring zero cross-contamination.
Fab Integration Advantages:
- Compatible with FOUP/SMIF pod loading for automated cassette handling, reducing human intervention
- Cleanroom-class design (ISO 5) with HEPA-filtered exhaust to maintain Class 1 environment compliance
- Recipe storage for 50+ cleaning protocols, adaptable to bare wafers, SOI wafers, and epi-wafers
Application: Essential for pre-litho, post-CMP, and post-etch cleaning in logic, memory, and MEMS fabrication lines.
Keywords: Semiconductor wafer ultrasonic cleaner, alkaline-acid sequential cleaning, UPW rinsing, 40-80KHz, 60℃ process, sub-micron decontamination